#15/26 August 2026 – Subscribe the newsletter – Contact editor – Visit SFBAC – Join IEEE
Editor’s Recommendations
New leadership training is now available! Dive into the latest on UltraEthernet and the ongoing transformations in the Magnet Industry. Plus, students have a unique opportunity to join the Minimalist Edge AI Challenge—be sure to register before the deadline.
Thriving Through Change
Change is constant, but guiding your team through it requires intentional leadership. Thriving Through Change equips managers with practical tools to navigate transitions smoothly—helping maintain productivity, boost morale, and protect customer satisfaction.
Key Takeaways:
- Lead teams confidently through complex organizational change
- Master the Bridges Transition Model to distinguish external change from internal transition.
- Recognize and manage common emotional responses: denial, resistance, exploration, commitment.
- Apply targeted leadership strategies for every stage of transition.
- Cultivate a resilient, adaptable team culture.
📍 Provided by Effective Training Associates (ETA) -Silicon Valley’s leader in training for engineers and managers. 📞Call 408.441.8881, or email laura@effectivetraining.com
CALL FOR PAPERS | ISQED 2027
The 28th International Symposium on Quality Electronic Design is a premier interdisciplinary conference dedicated to advancing the quality, reliability, security, and innovation of electronic and semiconductor system design.
ISQED 2027 will spotlight the technologies driving the next generation of semiconductor and electronic system innovation, including Agentic AI and Large Language Models (LLMs) for electronic design, heterogeneous chiplet architectures, advanced packaging and 3D integration, hardware security and trust, quantum computing, and next-generation IoT platforms.
Submission of Papers: Paper submission must be completed online through the ISQED Conference Portal.
Abstract/Paper Submission Deadline: September 17, 2026.
8/6, 4:00 pm, EPS, Dual Seed Semi-Additive and Damascene Processes: Enabling Fine-Pitch Interconnects for Advanced Packaging (Virtual) This presentation will introduce Nano Copper Deposition as a solution family for AI-era interconnect scaling. Speaker: Shinya Shimizu.
9/8, 7:00 pm, CNSV, Rewired for AI: An Introduction to UltraEthernet (Hybrid) This talk will provide an engineering-first primer on UltraEthernet—the industry’s collaborative answer to modern data center scaling. Speaker: Rip Sohan.
9/10, 6:30 pm, MAG, Permanent Magnets, A Material in Flux (Hybrid) We will discuss how changing tariffs, domestic sourcing requirements, and global market forces are reshaping the permanent magnet industry and what these trends mean for its future. Speaker; Dr. Stan Trout.
9/11, 6:30 pm, CIS/CS, Decoding the Invisible: Latent Representation and the Future of Human-AI Interaction (Virtual) This lecture explores the evolution of latent representations from Variational Autoencoders to Generative Adversarial Networks and finally to diffusion models and Stable Diffusion. Speaker: Dr. Narayan Srinivasa.
9/23, 5:30pm, PES/IAS, Critical Power Systems: Design & NEC Requirements (Santa Clara) Attendees will gain a clear understanding of National Electric Code (NEC )compliance requirements and practical design strategies that improve system reliability, maintainability, and resiliency. Speaker: Tyler Shewbert, P.E.
9/24,11:30 am, EPS, Glass-Core Packaging and Its Reliability (Milpitas) In this lecture, a brief fundamental of through-glass via (TGV) and redistribution-layers (RDLs) of glass packaging will be presented. Speaker: John Lau.
10/9, 12:00 pm, EPS/PHO, Co-Packaged Optical Transceivers for HPC, Data Center and Ai Applications (Virtual) This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based. The emphasis will be on new requirements and challenges driven by AI systems. Speaker: Daniel M. Kuchta, PhD.
10/13, 8:00 am, SCV/CS, Minimalist Edge AI Student Competition (Santa Clara) The Challenge invites student teams to tackle the “AI Bloat” head-on. This one-day competition challenges you to take state-of-the-art “heavy” models and transform them into lean, green, high-performance machines capable of running on constrained, eco-friendly hardware. Don’t miss registration deadline!
Calendar View of IEEE Events
If you have missed an event search it in the calendar above and contact the organizing chapter for a life recording or look for it on the chapter‘s archive page.
Contact us, and learn more about volunteering opportunities in our sections.
Use “IEEE” (case sensitive) discount code to receive 50% off admission to the Computer History Museum. IEEE members will be asked to show proof of membership to redeem their discount when arriving at the Museum. Direct ticket link.
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