#20/26 October 2026 – Subscribe the newsletter – Contact editor – Visit SFBAC – Join IEEE
Editor’s Recommendations
📌 Flagship Events: Call for Contributions for DAC 2027 is open, and tickets are available for the CASPA Annual Banquet (discount code inside!). ⚛️ Frontier Tech: Expert-led seminars on materials for quantum computing and scientific machine learning in electromagnetics.⚡Power & Packaging: Sharpen your skills in electrical design fundamentals, virtual power system modeling, and AI hardware failure analysis.
Data Driven Storytelling Workshop
Turn Complex Data into Powerful Narratives That Drive Action
Data alone rarely inspires action—stories do. Whether you’re presenting to executives, pitching a new initiative, or sharing project updates, metrics only tell half the story.
This hands-on workshop equips technical leaders, managers, and engineers with the tools to transform complex data into clear, compelling narratives that build trust, engage stakeholders, and accelerate decision-making.
What You’ll Learn
- Strategic Storytelling: Identify high-value story types aligned with your business goals.
- Repeatable Frameworks: Master a proven process for building narratives that deepen stakeholder trust.
- The Narrative Arc: Structure data storylines to highlight key insights, implications, and business impact.
- Humanizing Technical Data: Balance logic and emotion to make complex metrics relatable to any audience.
- Visual & Message Clarity: Use visuals and targeted messaging techniques to reinforce key takeaways.
- AI Collaboration: Prompt AI tools to analyze raw data and uncover hidden insights faster; Work alongside AI to generate slide decks and executive summaries optimized for decision-making.
📍 Effective Training Associates (ETA), based in Silicon Valley, is a global training company dedicated to empowering engineers and managers in the high-tech industry through specialized professional and management development programs. 📞Call 408.441.8881, or email laura@effectivetraining.com
Join us on Saturday, October 24, for the Legends of Engineering event. For more details, follow the link https://Luma.com/Legends2
IEEE Leadership Joins the 2026 CASPA Annual Conference & Dinner Banquet – CEO Summit
🗓️Dates: October 23–24, 2026
📍Location: Santa Clara Convention Center
IEEE is stepping onto the main stage at the 2026 CASPA CEO Summit, bringing IEEE leadership into dialogue with over 35 distinguished CEOs and semiconductor industry pioneers. This is a rare gathering uniting the industry’s key decision-makers under one roof to explore how today’s choices will shape the next era of technology—from advanced silicon to AI-driven systems.
Headlining the event alongside other industry luminaries is IEEE President & CEO Mary Ellen Randall.
As North America’s largest and most active IEEE section, the IEEE Santa Clara Valley Section is proud to support CASPA in advancing technology for humanity.
🎟️ Exclusive Offer & Registration
Due to an expanded lineup and strictly limited capacity, remaining tickets are moving fast. Enjoy 30% OFF all tickets by using promo code 30OFFINVITE at checkout!
Have questions? Contact IEEE SCV Section Chair Avery Lu at avery.j.lu@ieee.org.
CALL FOR PAPERS | ISQED 2027
The 28th International Symposium on Quality Electronic Design is a premier interdisciplinary conference dedicated to advancing the quality, reliability, security, and innovation of electronic and semiconductor system design.
ISQED 2027 will spotlight the technologies driving the next generation of semiconductor and electronic system innovation, including Agentic AI and Large Language Models (LLMs) for electronic design, heterogeneous chiplet architectures, advanced packaging and 3D integration, hardware security and trust, quantum computing, and next-generation IoT platforms.
Submission of Papers: Paper submission must be completed online through the ISQED Conference Portal.
Extended Paper Submission October 25, 2026.
Call for Contributions: 2027 DAC, The Chips to Systems Conference
San Jose Convention Center | July 11–14, 2027
AI is rapidly transforming the landscape of chip and system design. DAC, The Chips to Systems Conference, invites academic researchers and industry practitioners to submit groundbreaking work that addresses the next generation of semiconductor and system-level challenges.
We are seeking original contributions across five core tracks: AI, Design, EDA, Security, and Systems.
Leadership Team:
- General Chair: David Z. Pan (UT Austin & DeepWeave)
- Vice Chair: Natarajan (Nat) Viswanathan (Cadence Design Systems)
- Technical Program Chair: Ambar Sarkar (NVIDIA)
- Technical Program Co-Chairs: Rajiv Joshi (IBM) & Jiang Hu (Texas A&M University)
Formats: Research Papers, Engineering Presentations, Panels, Workshops, Tutorials, & DAC Pavilion Sessions
10/15, 7:00 am, IAS, Vendor Table for Electrical Design Fundamentals Seminar (Pleasanton) This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers.
10/15, 8:00 am, IAS, Electrical Design Fundamentals Seminar (Pleasanton) This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers.Speakers: multiple, see agenda
10/15, 11;30 am, NANO, Materials Science for Quantum Computing (Sunnyvale) In this seminar we will discuss how technologies developed to manufacture billions of highly controlled classical devices may help overcome the materials, fabrication, and integration barriers now limiting practical quantum systems. Speaker: Dr. Robert Visser.
10/21, 11:00 am, CS, Power System Modeling: What Makes a Model Meaningful (Virtual) The presentation will discuss the role of models, the information they can reliably represent, and their inherent limitations. Speaker: Dr. Pouyan Poubeik.
10/23, 9:00 am, EPS, Workshop: Decoding AI Hardware – Materials, Metrology, and Failure Analysis in Advanced Packaging (Hybrid) Join us for four practical talks, lab tours, lunch, and networking. Speakers: multiple, see agenda.
10/24, 7:30 pm, PES, Exploring Grid Inertia (and a Bit of Reactive Power) with Inverter-Based Resources: An Interactive Session (Stanford) We’ll cover why inertia matters, what inverter-based resources can and can’t do to replace it, and how reactive power support fits in. Host Fabian Cornejo.
10/27, 11:00 am, PES, Palo Alto Utility’s Grid Modernization with Stanford IEEE (Stanford) The Power and Energy Society will be hosting an informative presentation on Palo Alto Utility’s Grid Modernization efforts. Host Fabian Cornejo.
10/29, 4:00 pm, STB, Scientific Machine Learning for Electromagnetic Field Computations (Stanford) n this presentation, we discuss the potential of scientific machine learning methods to problems in computational electromagnetics employing an unsupervised learning strategy based on Physics-Informed Neural Networks (PINN). Speaker: Dr. Costas Sarris.
10/29, 5:00 pm, STB, Stanford IEEE Fireside Chat: Shang-Yi Chiang (Stanford) The conversation will cover the evolution of process technology, the future of the foundry industry, and advanced packaging, followed by open audience Q&A.
10/30, 9:30 am, MTT, Scientific machine learning for electromagnetic field computations (Berkeley) In this presentation, we discuss the potential of scientific machine learning methods to problems in computational electromagnetics employing an unsupervised learning strategy based on Physics-Informed Neural Networks (PINN). Speaker: Dr. Costas Sarris.
11/4, 6:00 pm, PELS, Maximizing performance of power electronics by minimizing magnetic energy storage (San Jose) Magnetic components’ cost, size and loss inhibit progress in power electronics. The required size is largely driven by the energy storage. Examples presented will include magnetics for high-current-density low voltage power delivery, and new circuits to replace 60 Hz transformers. Speaker: Prof. Charles R Sullivan.
11/5, 5:00 pm, STB, Stanford IEEE: The Power of Service (Stanford) The evening opens with a short talk on what service through IEEE can look like over a career, from student member to local volunteer to leadership. The event ends with informal networking.
11/7, 10:00 am, SSIT, Diffie-Hellman Key Exchange 50th Anniversary Global Celebration (Santa Clara) Drs. Diffie and Hellman, recipients of the 2015 ACM A.M. Turing Award, will be joining us in person. The day will honor what their work made possible and look ahead to the next 50 years of digital public infrastructure.
11/10, 6:45 pm, CNSV, Augmenting Human Intellect: The Mouse, The Mother of All Demos, The Unfinished Revolution ( Hybrid) This talk will trace the development of Engelbart’s vision, which was first inspired by Vannevar Bush’s Memex of 1945, and which led to Engelbart’s 1962 paper Augmenting Human Intellect: A Conceptual Framework and his 1968 Demo. Speaker: Jeff Rulifson
11/11 5:00 pm, STB, GSA Stanford Alum Panel (Stanford) The industry panel features Stanford alumni from GSA partner companies across the semiconductor industry. The event concludes with informal networking with the panelists.
11/11, 5:30 pm, SPS, From Fab to Boardroom: The Relationships That Actually Drive Careers (Santa Clara) Accelerate your career growth by building a personal “Board of Directors” and cultivating a high-impact support network. This session defines the core principles of effective mentorship. Walk away with practical, immediate steps to launch strategic relationships that drive long-term professional success. Speaker: Avery Lu.
11/12, 8:00 am, EPS, Seventh Annual IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP) (Hybrid) This 2-day symposium focuses on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. Speakers: multiple, see agenda.
11/13, 9:00 am, STB, AI Compute Orchestration: From Silicon to Systems (Stanford) STB, CASS, and Samsung Semiconductors is holding a half-day technical workshop on how AI compute is designed and orchestrated, from the transistor up to the datacenter.
11/19, 5:30 pm, IAS, Rethinking Data Center Electrical Infrastructure: Challenges and Opportunities of 800VDC Power Systems (Pleasant Hill) This presentation will examine the technical and economic drivers behind the transition toward Direct Current (DC) data centers. Speaker: Joel Liu, PhD.
12/3 6:00 pm, STB, Toy Story Screening & Live Q&A with Pixar Co-Founder Ed Catmull (Stanford) An evening with Pixar co-founder Ed Catmull followed by a screening of the original Toy Story.
Calendar View of IEEE Events
If you have missed an event search it in the calendar above and contact the organizing chapter for a life recording or look for it on the chapter‘s archive page.
Contact us, and learn more about volunteering opportunities in our sections.
Use “IEEE” (case sensitive) discount code to receive 50% off admission to the Computer History Museum. IEEE members will be asked to show proof of membership to redeem their discount when arriving at the Museum. Direct ticket link.
IEEE Leadership Joins the 2026 CASPA Annual Conference & Dinner Banquet – CEO Summit. Enjoy 30% OFF all tickets by using promo code 30OFFINVITE at checkout!
Aerospace and Electronics Systems Society (AESS) * Antenna and Propagation Society (APS) * Blockchain (BC) * Circuits & Systems Society (CASS) * Consultants’ Network of Silicon Valley (CNSV)* Consumer Technology Society (CTSoc) * Control Systems Society (CSS) * Communications Society (ComSoc) * Computer Society (CS)* Computational Intelligence Society (CIS) * Corporate Liaison Program (CLP) * Electron Devices Society (EDS) * Electronic Packaging Society (EPS) * Electromagnetic Compatibility (EMC) * Engineering In Medicine & Biology Society (EMBS) * Industry Applications Society (IAS) * Industry Engagement (IE) * Life Members Affinity Group (LMAG)* Magnetics Society (MAG) * MEMS & Sensors Council (MEMS) * Microwave Theory & Techniques (MTT) * Nanotechnology Council(NANO) * Nuclear & Plasma Sciences (NUE) * Photonics (PHOT)* Power & Energy Society (PES) & Industry Applications Society (IAS) * Power Electronics Society (PELS) * Product Safety Engineering (PSE) * Reliability (REL) * Robotics & Automation (RAS) * Silicon Valley Sustainability Chapter (SUST) * Signal Processing Society (SPS) * Silicon Valley Technology History Committee (SVTHC) * Society for Social Implications of Technology (SSIT) * Solid State Circuits Society (SSCS) * Startup Special Interest Group (SIG) * Student Branch (STB) * Technology and Engineering Management Society (TEMS) * Vehicular Technology Society (VTS) * Women In Engineering Affinity Group (WIE) * Young Professionals Affinity Group (YP)