#17/26 September 2026 Subscribe the newsletterContact editorVisit SFBACJoin IEEE

Editor’s Recommendations 

Don’t miss out: The ISQED ’26 paper submission deadline is almost here, and registration for the Wearable Technologies Conference is coming to an end! Join industry leaders to explore key trends in magnet technology and the latest breakthroughs in AI.

Learning and Training


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  • Get to the Point — Structure clear, concise, persuasive messages that make complex technical data actionable.
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  • Manage Interaction — Encourage engagement, handle challenging questions with ease, stay on message, and defuse difficult interactions.
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Conferences and Workshops


CALL FOR PAPERS | ISQED 2027

The 28th International Symposium on Quality Electronic Design is a premier interdisciplinary conference dedicated to advancing the quality, reliability, security, and innovation of electronic and semiconductor system design. 

ISQED 2027 will spotlight the technologies driving the next generation of semiconductor and electronic system innovation, including Agentic AI and Large Language Models (LLMs) for electronic design, heterogeneous chiplet architectures, advanced packaging and 3D integration, hardware security and trust, quantum computing, and next-generation IoT platforms

Submission of Papers: Paper submission must be completed online through the ISQED Conference Portal.

Abstract/Paper Submission Deadline: September 17, 2026.

Achieving a More Reliable and Resilient Energy Future

Hosted by Pacific Gas & Electric (PG&E), this year’s summit convenes utility professionals, solution providers, and industry leaders to explore practical solutions for strengthening the reliability and resilience of our electric power grid.

Why Attend?

  • Expert Insights: Grid impacts of AI, wildfire mitigation, & extreme weather response.
  • Actionable Tech: Technical tours & best practices for reliability.
  • High-Impact Networking: Connect with industry and utility leaders.

Registration is open (Hotel deadline: Sept 5);

IEEE Local Chapter Events


9/2, 3:00 pm, COM/CIS, Machine Learning over Networks: From Fundamentals to Applications (Santa Clara) In this talk, we review sample results based on our recent work in the areas of machine learning over networks and edge intelligence. Speaker: Dr. Tamer ElBatt.

9/3, 6:00 pm, OEB, Science Exploratorium : After Dark (San Francisco) Journey through total darkness in our twisting, turning, world-famous Tactile Dome. Limited seats.

9/3, 7:00 pm, TEMS, When AI Changes the Rules: Delegation and Design of Team Work (Virtual) In this talk, Sean Murphy explores how engineering and design managers can rethink delegation and the design of teamwork in an AI-enabled organization. Speaker: Sean Murphy.

9/8, 7:00 pm, CNSV, Rewired for AI: An Introduction to UltraEthernet (Hybrid) This talk will provide an engineering-first primer on UltraEthernet—the industry’s collaborative answer to modern data center scaling. Speaker: Rip Sohan.

9/9, 8:30 am, EMBS, UCI GET PHIT Pre-Summit Training Day: An Amazon Web Services Workshop (Virtual) This program is designed to give public health students, professionals and technologists a hands-on, practical introduction to the AWS tools and services most relevant to their work. Speaker: Paul Butler.

9/10, 8:00 am, EMBS, UCI PHIT Summit 2026: Digital & Public Health Informatics & Technology: Workforce of the Future (Virtual) Key areas of discussion include Emerging Technologies; Devices & Apps; Aging, Longevity & Lifestyle; Healthcare & Public Health Systems; Standards and Interoperability; Informatics, Technology & Standards; Society & Mental Health; and Disease Informatics. Speakers: multiple, see agenda.

9/10, 6:30 pm, MAG, Permanent Magnets, A Material in Flux (Hybrid) We will discuss how changing tariffs, domestic sourcing requirements, and global market forces are reshaping the permanent magnet industry and what these trends mean for its future. Speaker; Dr. Stan Trout.

9/11, 6:30 pm, CIS/CS, Decoding the Invisible: Latent Representation and the Future of Human-AI Interaction (Virtual) This lecture explores the evolution of latent representations from Variational Autoencoders to Generative Adversarial Networks and finally to diffusion models and Stable Diffusion. Speaker: Dr. Narayan Srinivasa.

9/15, 9:00 am, EMBS/RAS, IEEE AgeTech, EMBS & RAS Take the Stage at Wearable Technologies Conference: Innovating for a $7 Trillion AgeTech Future (Mountain View) Don’t miss this opportunity to discover what’s next in wearable technology. Join us for the two days event. IEEE discount available. Speakers: see agenda.

9/15, 3:00 pm, CS, Protecting the Island: The Asynchronous Generation Challenge in Fiji. (Virtual) This webinar explores how the shift toward asynchronous generation impacts traditional protection schemes within the context of Fiji’s islanded power grids. Speaker: Krishneel Prasad.

9/15, 6:00 pm, SSIT, IEEE P3469 Standard Will Enable an Accounting Method For Carbon Content in a Supply Chain ( Santa Clara) Join us for a Member Technical Meeting on how the proposed IEEE P3469 Standard could enable more accurate and auditable accounting of carbon emissions across complex supply chains. Speaker: Tom Coughlin.

9/17, 5:30 pm, WIE, Build Claude​ Agents Around​ Your Strengths &​ Style (Virtual) This session is dedicated to building a Claude OS & other AI agents. Speaker: Mia Bowyer.

9/17, 5:30 pm, IAS, PG&E’s Distributed Energy Resource Management System (DERMS) (Pleasant Hill)  This presentation will provide insights and lessons learned regarding deploying a DERMS to help large PG&E customer sites like front of the meter batteries and large EV charging stations connect flexibly and more quickly to a constrained grid. Speaker: Rustom Dessai.

9/17, 6:30 pm, MAG, How Hard Can a Magnet Be? (Hybrid) The talk will explore the century-old puzzle of magnetic coercivity, including Brown’s Paradox and recent progress toward understanding magnetic hardening. Speaker: Dr. J. Ping Liu.

9/23, 5:30pm, PES/IAS, Critical Power Systems: Design & NEC Requirements (Santa Clara) Attendees will gain a clear understanding of National Electric Code (NEC )compliance requirements and practical design strategies that improve system reliability, maintainability, and resiliency. Speaker: Tyler Shewbert, P.E.

9/24,11:30 am, EPS, Glass-Core Packaging and Its Reliability (Milpitas) In this lecture, a brief fundamental of through-glass via (TGV) and redistribution-layers (RDLs) of glass packaging will be presented. Speaker: John Lau.

9/28, 5:00 pm, CIS, 2026 GET-AI SERIES: 6 — Enabling Autonomous Operations (Virtual) By combining foundational concepts with architecture patterns and live demonstrations, the September session will help attendees understand how organizations can progress from AI assistance to intelligent, governed autonomous operations. Speakers: see agenda.

10/6, 9:00 am, PES/IAS, IEEE Power and Energy Society Resiliency Summit: Achieving a More Reliable and Resilient Energy Future (San Francisco) Hosted by PG&E, this year’s summit convenes utility professionals, solution providers, and industry leaders to explore practical solutions for strengthening the reliability and resilience of our electric power grid. Speakers: multiples, see agenda

10/7, 2:00 pm, WIE, IEEE SCV WIE AI Summit 2026 (Santa Clara) Our sessions will cover the latest developments in Large Language Models and Foundation Models, exploring efficient fine-tuning, multilingual adaptation, and the role of LLMs as knowledge bases. Speakers: see agenda

10/8, 4:00 pm, PES/YP/WIE, IEEE PES Resiliency Summit Networking, Moroccan Dinner & Show (San Francisco) PES Industry Leaders to share about their careers, challenges and excitement for the next generation of engineers, followed by speed networking, dinner and show. Tickets are limited.

10/9, 12:00 pm, EPS/PHO, Co-Packaged Optical Transceivers for HPC, Data Center and Ai Applications (Virtual) This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based. The emphasis will be on new requirements and challenges driven by AI systems. Speaker: Daniel M. Kuchta, PhD.

10/13, 8:00 am, SCV/CS, Minimalist Edge AI Student Competition (Santa Clara) The Challenge invites student teams to tackle the “AI Bloat” head-on. This one-day competition challenges you to take state-of-the-art “heavy” models and transform them into lean, green, high-performance machines capable of running on constrained, eco-friendly hardware. Don’t miss registration deadline!

10/14, 11:00 am, LMAG, USS Hornet Lunch & Tour + California Historical Radio Society Visit – Alameda (Alameda) We are hosting an excursion to two historical locations in Alameda CA, including lunch – this is like winning the “daily double” Speakers: see agenda for details.

10/15, 7:00 am, IAS, Vendor Table for Electrical Design Fundamentals Seminar (Pleasanton) This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers.

10/15, 8:00 am, IAS, Electrical Design Fundamentals Seminar (Pleasanton) This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers.Speakers: multiple, see agenda

10/23, 9:00 am, EPS, Workshop: Decoding AI Hardware – Materials, Metrology, and Failure Analysis in Advanced Packaging (Hybrid)  Join us for four practical talks, lab tours, lunch, and networking. Speakers: multiple, see agenda.

11/12, 8:00 am, EPS, Seventh Annual IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP) (Hybrid) This 2-day symposium focuses on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. Speakers: multiple, see agenda.

Calendar View of IEEE Events

If you have missed an event search it in the calendar above and contact the organizing chapter for a life recording or look for it on the chapter‘s archive page.

Volunteering Opportunities


Contact us, and learn more about volunteering opportunities in our sections. 

Discounts for IEEE Members


 Use “IEEE” (case sensitive) discount code to receive 50% off admission to the Computer History Museum. IEEE members will be asked to show proof of membership to redeem their discount when arriving at the Museum. Direct ticket link.

IEEE Member get a 50% discount to the Wearable Technologies Conference USA when buying the ticket through vTools. Follow the link.

Aerospace and Electronics Systems Society (AESS) * Antenna and Propagation Society (APS) * Blockchain (BC) * Circuits & Systems Society (CASS) * Consultants’ Network of Silicon Valley (CNSV)* Consumer Technology Society (CTSoc) * Control Systems Society (CSS) * Communications Society (ComSoc) * Computer Society (CS)* Computational Intelligence Society (CIS) * Corporate Liaison Program (CLP) * Electron Devices Society (EDS) * Electronic Packaging Society (EPS) * Electromagnetic Compatibility (EMC) * Engineering In Medicine & Biology Society (EMBS) * Industry Applications Society (IAS) * Industry Engagement (IE) * Life Members Affinity Group (LMAG)* Magnetics Society (MAG) * MEMS & Sensors Council (MEMS) * Microwave Theory & Techniques (MTT) * Nanotechnology Council(NANO) * Nuclear & Plasma Sciences (NUE) * Photonics (PHOT)* Power & Energy Society (PES) & Industry Applications Society (IAS) * Power Electronics Society (PELS) * Product Safety Engineering (PSE) * Reliability (REL) * Robotics & Automation (RAS) * Silicon Valley Sustainability Chapter (SUST) * Signal Processing Society (SPS) * Silicon Valley Technology History Committee (SVTHC) * Society for Social Implications of Technology (SSIT) * Solid State Circuits Society (SSCS) * Startup Special Interest Group (SIG) * Student Branch (STB) * Technology and Engineering Management Society (TEMS) * Vehicular Technology Society (VTS) * Women In Engineering Affinity Group (WIE) * Young Professionals Affinity Group (YP)