#9/26 May 2026 – Subscribe the newsletter – Contact editor – Visit SFBAC – Join IEEE
Editor’s Recommendations
Visit our booth and networking event at Sensors Converge 2026 on May 6th. Don’t miss the VTS Technical Townhall on May 12th covering AI safety for autonomous vehicles, and register now for DAC 2026 to see keynote speaker and Nobel Laureate John Martinis.
Job Opportunities
Engineering Extended Studies
Charles W Davidson College of Engineering
SJSU Engineering Extended Studies is seeking AI experts, especially those interested in data engineering, machine learning, generative AI, and intelligent systems, to support the continued growth of our Master’s in AI programs.
We are considering new instructors to teach 11-week, fully online graduate courses that meet one evening per week.
Interested candidates should email noemi.timogan@sjsu.edu with (1) a resume or LinkedIn profile and (2) the AI subject areas or courses they are interested in teaching. Don’t miss this opportunity—email by July 1, 2027.
Effective Training Associates (ETA) provides specialized development for Silicon Valley engineers and managers. Elevate your skills with these upcoming AI-focused courses:
- AI-Ready at Work: Learn to use AI tools to become more productive, efficient, and effective. Participants will explore ways to streamline work, enhance creativity, and strengthen decision-making skills.
- Developing Content for Presentations with AI: Learn to tailor presentations to different audiences and communicate your key results clearly to sponsors, executives and customers.
- Presentation Skills with AI: Master delivering high-impact presentations by improving preparation, design, delivery, and Q&A using AI tools and an Opening Framework to tailor messages and build compelling.
For more details contact us, or visit our web page!
Where Innovation Meets Impact
Sensors Converge is North America’s largest event where sensing, processing, and connectivity converge to shape the future of intelligent systems.
At Sensors Converge, your mission is simple: design smarter technologies, accelerate development, and power the next generation of intelligent electronics.
Explore advancements across edge computing, IoT, MEMS, power systems, embedded design, and AI-driven engineering – all under one roof.
Registration has started. Secure your FREE Expo Hall Pass or an extra $100 off VIP / Conference Passes. Use code: IEEESCV200.
On the 2026 expo floor, your products don’t just get seen — they get tested, discussed, compared, and adopted. Request more information
Sensors Converge May 5-7, 2026 Santa Clara Convention Center
VTS · PSES · CNSV · LMAG · ASME
The Intelligence of the Machine. The Rigor of the Road
May 12, 2026, 5:00 -7:00 pm | SEMI, 673 S Milpitas Blvd Milpitas, CA
Hybrid Event: Register now
In-Person attendance
Virtual attendance
Join us for an industry-led technical townhall addressing critical advancements in next-generation firmware standards and rare-event safety protocols for autonomous AI.
5:00 – 5:30 pm Professional Networking & Reception
5:30–6:15 pm Standardizing Automotive Firmware for SDVs Panelists François Piednoël, Athos Silicon, Sachin Athanikar, Mercedes-Benz, and Dong Wei, Arm examine the architectural requirements for secure, vendor-agnostic firmware foundations in modern vehicle stacks.
6:15–6:45 pm Safe Embodied AI: From Theory to Deployment Prof. Ding Zhao, Carnegie Mellon University, presents methodologies for rare-event safety and scalable rollout strategies for autonomous systems.
6:45–7:15 pm Static Safety Is Dead: Continuous Risk & Compliance for SDVs Akshay Chalana, Saphira AI, discusses the transition from static certification to dynamic, system-aware safety models.
7:15 – 7:30 Technical Q&A | Moderator Aditi Ramadwar
DAC: The Premier Event for Chips to Systems
July 26 – 29, 2026 | Long Beach Convention Center
For over 60 years, DAC has served as the heartbeat of the semiconductor ecosystem. We invite you to join us for four days of world-class technical training, groundbreaking research, and unparalleled networking with the industry’s leading designers, researchers, and vendors. From AI and EDA to Security and Systems, DAC 2026 showcases the latest methodologies driving the future of electronic design.
Featured Keynotes:
- John Martinis – CTO & Co-Founder Qolab and 2025 Nobel Laureate in Physics
- Dr. Baaziz Achour – EVP and CTO, Qualcomm
- Jan Rabaey – Professor Emeritus UC Berkeley
John Martinis
Dr Baaziz Achour
John Rabey
SKYTalks Highlighs:
- SUNDAY WELCOME: Timothy Costa – GM, NVIDIA
- Lalitha Immaneni– VP Semiconductor Research, Intel
- Dr. Huiming Bu – VP Global Semiconductor, IBM Research
- Artour Levin – VP AI Silicon Engineering, Microsoft
Timothy Costa zzzzzz Lalitha Immaneni zzzzzz Dr Huiming Bu zzzzzz Artour Levin
Why Attend?
Whether you’re looking to gain insights from leading researchers and designers or connect with the world’s top chip designers, DAC 2026 is where the industry’s future is built.
05/05, 10:00 am, PELS, Chip-Scale High-Voltage Power Supplies (Virtual) This talk covers research on miniaturized power supplies using high-voltage IC technologies from110/230V mains or 400V DC sources to power low-voltage subsystems. Speaker: Dr. Bernhard Wicht.
05/06, 6:30 pm, SCV, IEEE SCV Networking Event at the Sensors Converge 2026 (Santa Clara) IEEE SCV Section invites all professionals and members attending Sensors Converge to an exclusive evening of networking and industry connection. See you there!
05/06, 6:00 pm, VTS, Edge AI + Telematics: Safety, and the Edge–Cloud Split in Modern Vehicles (Virtual) This talk explores how Edge AI deployed within connected vehicles is enabling practical safety and telematics use cases—such as real‑time crash detection, while complementing cloud intelligence. Speaker: Pushpak Sarang.
05/07, 10:00 am, PES/IAS, Process Sensor Monitoring for Cyber Security, Reliability, and Safety at Sensors Converge (Santa Clara) Monitoring the process sensors can also help identify confirmed and potential cyber incidents with equipment such as pumps, compressors, valves, transformers, etc. Speaker: Joe Weiss.
05/07, 12:00 pm, EPS, Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing, Virtual. The speaker will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. Speaker: Francesco Carobolante.
05/07, 6:30 pm, TEMS, Effective Networking: Grow Your Circles of Influence (Santa Clara) Networking expert Cesar Plata will lead us through a dynamic, interactive session where we will practice proven techniques to expand your professional reach. Speaker: Cesar Plata.
05/12, 5:00 pm, VTS/LMAG, The Intelligence of the Machine.. The rigor of the road (Milpitas). This technical forum brings together OEMs, Tier-1 suppliers, semiconductor leaders, researchers, and innovators to address the challenge of fragmentation and define a unified, future-ready mobility stack. Students are especially encouraged to attend. Speakers: multiple see agenda.
05/14, 3:45 pm, SCV, IEEE Milestone Dedication: MIS‑1 at El Camino Hospital (Hybrid) Honoring the historic collaboration between Lockheed and El Camino Hospital that revolutionized the field of medical informatics.
05/19 8:00 am, EPS, Third Annual IEEE Build-Up Substrate Symposium (San Jose) This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. Speakers: multiple, see agenda.
5/20, 6:00 pm, MTT, Sensing, Tracking, and Secured Communication with Artificial Electromagnetic Materials (Hybrid) The talk will present Metamaterials (MTMs) and their application in developing innovative Composite Right/Left-Handed Leaky-Wave Antennas (CRLH LWAs). Speaker: Dr. Chung-Tse Michael Wu.
5/21, 5:30 pm, IAS, Beyond IR Windows: Continuous Thermal Monitoring for Critical Electrical Assets (Pleasant Hill) This presentation will examine Continuous Thermal Monitoring (CTM) as a modern, code‑aligned approach for monitoring critical electrical assets. Speaker: Jonathan Fromm.
5/22, 12:00 pm, EPS, Failure Analysis of Engineering Materials for Advanced Electronic Packaging (Virtual) Effective failure analysis is vital for enhancing product quality, reliability, and safety. This multidisciplinary task requires the integration of fundamental material science with technological expertise in manufacturing processes and product operation. Speaker: Professor Kuan Yew Cheong.
05/25, 9:00 am, IEEE Canada Blockchain Forum 2026 (4th edition) (Virtual) The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Speakers: multiple see agenda.
05/26 4:45 pm Trust in AI Systems: Detecting, Defending, and Securing Intelligent Agents (Virtual) This double-feature session combines deep technical insights with real-world security demonstrations, designed for architects, developers, researchers, and security leaders. Speakers: Zhou Li, Sreekanth Reddy Panyam.
06/05, 12:00 pm, WIE, Human System Engineering Initiatives: From Human Views to Human Readiness Levels (Virtual) This talk discusses the role of Human System Engineering within the System Engineering discipline. Current standards and applications will be included. Speaker: Dr. Holly A. H. Handley.
6/15, 9:00 am, EPS, Biodegradable Electronics in the Semiconductor Era (Virtual) This talk will examine how biodegradable electronics can be positioned within the broader semiconductor ecosystem through innovations in functional materials, low-temperature processing, flexible device platforms, and sustainable integration strategies. Speaker: Prof. Shweta Agarwala.
6/17, 6:30 pm, MAG, AI in Magnetism: Impact, Challenges and Risks (Hybrid) This talk will introduce AI’s role in advancing magnetism research and cover AI fundamentals, data requirements, and key challenges. Speaker: Dr. Peter Fischer.
6/24, 8:00 am, CS/SPS, Center for Advanced Signal and Image Sciences (CASIS) 29th Annual Workshop (Livermore) This year no-fee workshop features presentations in the following tracks: AI/Machine Learning, National Ignition Facility, Non-Destructive Evaluation, Quantum Sensing & Computing, Remote Sensing, Non-Invasive Imaging & Inverse Problems, Robotics & Automation, Student Track. Speakers: see agenda.
Calendar View of IEEE Events
If you have missed an event search it in the calendar above and contact the organizing chapter for a life recording or look for it on the chapter‘s archive page.
Contact us, and learn more about volunteering opportunities in our sections.
Use “IEEE” (case sensitive) discount code to receive 50% off admission to the Computer History Museum. IEEE members will be asked to show proof of membership to redeem their discount when arriving at the Museum. Direct ticket link.
Sensor Converge 2026 discount. Secure your FREE Expo Hall Pass or an extra $100 off VIP / Conference Passes. Use code: IEEESCV200.
* Antenna and Propagation Society (APS) * Blockchain (BC) * Circuits & Systems Society (CASS) * Consultants’ Network of Silicon Valley (CNSV)* Consumer Technology Society (CTSoc) * Control Systems Society (CSS) * Communications Society (ComSoc) * Computer Society (CS)* Computational Intelligence Society (CIS) * Corporate Liaison Program (CLP) * Electron Devices Society (EDS) * Electronic Packaging Society (EPS) * Electromagnetic Compatibility (EMC) * Engineering In Medicine & Biology Society (EMBS) * Industry Applications Society (IAS) * Industry Engagement (IE) * Life Members Affinity Group (LMAG)* Magnetics Society (MAG) * MEMS & Sensors Council (MEMS) * Microwave Theory & Techniques (MTT) * Nanotechnology Council(NANO) * Nuclear & Plasma Sciences (NUE) * Photonics (PHOT)* Power & Energy Society (PES) & Industry Applications Society (IAS) * Power Electronics Society (PELS) * Product Safety Engineering (PSE) * Reliability (REL) * Robotics & Automation (RAS) * Silicon Valley Sustainability Chapter (SUST) * Signal Processing Society (SPS) * Silicon Valley Technology History Committee (SVTHC) * Society for Social Implications of Technology (SSIT) * Solid State Circuits Society (SSCS) * Startup Special Interest Group (SIG) * Student Branch (STB) * Technology and Engineering Management Society (TEMS) * Vehicular Technology Society (VTS) * Women In Engineering Affinity Group (WIE) * Young Professionals Affinity Group (YP)