#23/25 November 2025 – Subscribe the newsletter – Contact editor – Visit SFBAC – Join IEEE
Editor’s Recommendations
We are excited to announce the Call for Papers for ECCE 2026, which represents a significant opportunity for innovation and collaboration within the field of energy conversion. Upcoming talks will include compelling topics such as Biological Nanoparticles and AI for Thermal Management for Electronic Systems. Additionally, our first symposiums for 2026 have been published. Please review the details and register soon to secure your spot. We look forward to your participation.
The AI-Ready Manager
This in-person or virtual training teaches managers how to use AI tools to become more productive, efficient, and effective. Through self-reflection, group activities, hands-on demos, and practice, participants will explore ways to streamline work, enhance creativity, strengthen decision-making, and improve coaching and feedback skills. Each manager will leave with a personalized AI action plan they can immediately apply.
Learning Objectives:
- Explore the opportunities AI offers to today’s managers
- Write effective prompts to maximize AI’s value
- Use AI to boost productivity in everyday management tasks
- Leverage AI as a thought partner in decision-making
- Practice and enhance feedback, coaching, and communication skills
- Identify AI’s risks, challenges, and compliance considerations
- Create a personal AI action plan to sustain learning and momentum
Effective Training Associates, located in Silicon Valley, provides global training programs for engineers and managers in the high-tech industry. For more information email us. or visit www.effectivetraining.com
DAC 2026 Conference – Call for Contributions
Long Beach Convention Center, CA,
July 25-29, 2025.
DAC is the premier conference for the design and automation of electronic circuits and systems. Submit to DAC 2026 and be part of tomorrow’s innovation. Focus areas are: AI, Design, EDA, Systems and Security. If you are in the electronic design field, this is the NOT TO MISS event.
Call for Engineering Track Contribution deadline: January 12th.
IEEE Energy Conversion Congress & Expo
Convention Center, Vancouver, BC,
October 4-8, 2026.
ECCE 2026 is the pivotal international conference and exposition event on the electrical and electromechanical energy conversion field. The Conference will bring together practicing engineers, researchers, and other professionals for interactive and multidisciplinary discussions on the latest advances in various areas related to energy conversion.
Call for Papers is open. Focus areas are : component, converter and subsystem technologies and energy conversion systems and applications. For details visit out submission web page.
IEEE Local Chapter Events
12/2, 6:00 pm, COM, High Performance Inferencing for LLMs, Virtual. This talk focuses on system-level optimization techniques that maximize token throughput , achieve user experience metrics and inference service-provider efficiency. Speaker: Ravishankar Ravindran.
12/4, 12:00 pm, EPS, Characterization and Application of a New Chip-Level Air Pump, Virtual. µCooling: A new device has been invented that changes the way thermal engineers are approaching system cooling design. µCooling is a new concept in air movers. It is small, and thin and is a complete departure from rotating mass fans. Speaker: Tom Tarter.
12/4, 6:30 pm, TEMS, Navigating your Career: Lessons Learned and Success Strategies, Hybrid. In this talk, I’ll share lessons learned from my own journey and from others who’ve navigated career twists, pauses, and pivots. Speaker: Jill Gostin.
12/9, 6:30 pm, CNSV, Size Really Does Matter: Biological Nanoparticles Are Changing Biomedicine, Hybrid. In this talk, will discuss the challenges, and the promise, of exosomes in biomedical diagnostics. Speaker: Dr. Giacomo Vacca.
12/11, 9:00 am, EPS, AI for Thermal Management of Electronic Systems: A Pathway to Digital Twins, Virtual. In this talk, I will present recent and ongoing research activities at ES2 Binghamton on AI-enabled thermal management design, with emphasis on cooling solutions for high-power chips in data centers. Speaker: Srikanth Rangarajan.
12/11, 12:00 pm, EPS, Digital Lithography: Addressing Scaling Challenges in Advanced Packaging, Virtual. The talk will preview Applied Materials’ Digital Lithography Technology (DLT) which enables highest resolution at production throughputs while ensuring CD uniformity and overlay accuracy across the entire panel. Speaker: Niranjan Khasgiwale.
12/16, 12:00 pm, PSE, Product Safety and Compliance Meetup, Virtual. invites you to a virtual meetup of professionals interested in product safety and compliance. We will discuss the future of the chapter and plan future events.
01/13/2026, 7:00 pm, CNSV, Energy and Thermal Management of IT Systems, Hybrid. This talk will present a holistic approach that traces the energy flow from a power plant to a chip, and from the chip core to the cooling tower. Speaker: Chandrakant Patel.
01/15/2026, 5:30 pm, IAS, Short-Circuit Current Ratings, Interrupting Ratings, and the Intersection of UL 508A and the NEC, Pleasant Hill. The presentation examines how UL product listings and component ratings interact with NEC Articles 409, 110.9, and 110.10, clarifying how available fault current, protective device selection, and equipment labeling all converge in practice. Speaker: Tyler Shewbert.
01/22/2026, 8:00 am, EPS, IEEE/EPS Hybrid Bonding Symposium, Milpitas. Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design. Speakers: multiple, see event link.
02/10/2026, 7:00 pm, CNSV, Designing an Artificial Heart: A Systems Approach to Building the Impossible, Hybrid. Ian will walk through a practical framework for managing complexity: identifying unknowns early, building parallel test beds, using simulation to reduce risk before fabrication, and validating assumptions through rapid physical prototyping. Speaker: Ian Coll McEachern.
02/19/2026, 8:00 am, EPS, Ninth Annual Symposium on Heterogeneous Integration Roadmap and Annual Meeting, Milpitas. Vision for Heterogeneous Integration from Global Perspectives, 2 days, keynote talks, working groups and more. Speakers: multiple, see agenda.
Calendar View of IEEE Events
If you have missed an event search it in the calendar above and contact the organizing chapter for a life recording or look for it on the chapter‘s archive page.
Join one of our local chapters and get involved with the latest trends in technology. Pick your chapter!
IEEE Entrepreneurship Hard Tech Venture Summit Organizing Committee is looking for volunteers and advisors The event is planned in the Bay Area in February 2026. For more details please contact Bruno lafelice at bruno@tvlp.co
Use “IEEE” (case sensitive) discount code to receive 50% off admission to the Computer History Museum. IEEE members will be asked to show proof of membership to redeem their discount when arriving at the Museum. Direct ticket link.
IEEE Member discount available at the TechEquity Ai Summit 2025 | Silicon Valley on November 7-8 in Sunnyvale. IEEECODE-80: 80% Discount Code— Conference Pass; IEEEWORKSHOPS15: 15% off discount for our Workshops
* Antenna and Propagation Society (APS) * Blockchain (BC) * Circuits & Systems Society (CASS) * Consultants’ Network of Silicon Valley (CNSV)* Consumer Technology Society (CTSoc) * Control Systems Society (CSS) * Communications Society (ComSoc) * Computer Society (CS)* Computational Intelligence Society (CIS) * Corporate Liaison Program (CLP) * Electron Devices Society (EDS) * Electronic Packaging Society (EPS) * Electromagnetic Compatibility (EMC) * Engineering In Medicine & Biology Society (EMBS) * Industry Applications Society (IAS) * Industry Engagement (IE) * Industry Hub (IIH) * Instrumentation & Measurement Society (IMS) * Life Members Affinity Group (LMAG)* Magnetics Society (MAG) * MEMS & Sensors Council (MEMS) * Microwave Theory & Techniques (MTT) * Nanotechnology Council(NANO) * Nuclear & Plasma Sciences (NUE) * Photonics (PHOT)* Power & Energy Society (PES) & Industry Applications Society (IAS) * Power Electronics Society (PELS) * Product Safety Engineering (PSE) * Reliability (REL) * Robotics & Automation (RAS) * Silicon Valley Sustainability Chapter (SUST) * Signal Processing Society (SPS) * Silicon Valley Technology History Committee (SVTHC) * Society for Social Implications of Technology (SSIT) * Solid State Circuits Society (SSCS) * Startup Special Interest Group (SIG) * Student Branch (STB) * Technology and Engineering Management Society (TEMS) * Vehicular Technology Society (VTS) * Women In Engineering Affinity Group (WIE) * Young Professionals Affinity Group (YP)