#7/26 April 2026 – Subscribe the newsletter – Contact editor – Visit SFBAC – Join IEEE
Editor’s Recommendations
Final Call: Registration for ISQED ’26 is closing—secure your spot now! Limited Space: Seats are still available for the Hard Tech Venture Summit. Open Now: DAC 2026 registration is officially live. Save the Date: Check out Sensors Converge and watch for our upcoming IEEE SCV Networking Event. Student Focus: This month we are highlighting events tailored for student learning and networking. Look for the special markers throughout this Local Chapter Events summary to find these opportunities.
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The 27th ISQED Conference April 8-10, 2026
Registration is now open for the 27th International Symposium on Quality Electronic Design (ISQED), taking place April 8-10, 2025. ISQED is the leading conference for design for manufacturability (DFM) and quality (DFQ) issues. As the leading event in the field, it is your chance to network with top experts across the electronics and semiconductor ecosystem. Register today!
Hard Tech Venture Summit Silicon Valley
April 16-17, 2026 – SRI, Menlo Park
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A premier, curated event for Hard Tech ecosystem |
Last year attendees’ experience.
Meet ONLY Hard Tech funds & several angels in one place—over a full-day.
Join a curated group of startups and investors to spend the day chatting and sharing opinions in structured roundtables, plus informal networking during coffee breaks and lunch. This is not a typical pitch event. It’s a format designed by Hard Tech investors and entrepreneurs to boost key relationships and accelerate the path to capital and commercialization.
Much more than transactional pitching.
Confirmed investors include: Intel Capital, Yamaha Motor Ventures, At One Ventures, TSVC, Monozukuri Ventures, i3 Ventures, Departure Ventures, REDDS Capital, Ecosystem Ventures, Corelabs Capital, Althing Ventures, Navis Capital, Samsung Next, Sony, Bosch Ventures, and a number of active angel investors.
Startup seats are limited to maintain a 2:1 startup-to-investor ratio, and filling fast. (Advance pricing ends April 6) Startup seats are limited to maintain a 2:1 startup-to-investor ratio, and filling fast.
Where Innovation Meets Impact
Sensors Converge is North America’s largest event where sensing, processing, and connectivity converge to shape the future of intelligent systems.
At Sensors Converge, your mission is simple: design smarter technologies, accelerate development, and power the next generation of intelligent electronics.
Explore advancements across edge computing, IoT, MEMS, power systems, embedded design, and AI-driven engineering – all under one roof.
Registration has started. Secure your FREE Expo Hall Pass or an extra $100 off VIP / Conference Passes. Use code: IEEESCV200.
On the 2026 expo floor, your products don’t just get seen — they get tested, discussed, compared, and adopted. Request more information
Sensors Converge May 5-7, 2026 Santa Clara Convention Center
DAC: The Premier Event for Chips to Systems
July 26 – 29, 2026 | Long Beach Convention Center
For over 60 years, DAC has been the heartbeat of the semiconductor ecosystem. Join us for four days of world-class training, cutting-edge research, and unparalleled networking with the industry’s leading designers, researchers, and vendors.
From AI and EDA to Security and Systems, DAC focuses on the latest methodologies driving the future of electronic design. Whether you are looking to sharpen your skills through technical training or connect with tool developers and practitioners, DAC 63 is where the industry’s future is built.
Secure your place at the forefront of electronic design.
04/01,5:30 pm, EMC, Augmented Intelligence for End-to-End Design (San Jose) In this talk, I will share practical examples and key insights from several years of applying Augmented Intelligence to end-to-end design, highlighting how human–AI collaboration is reshaping the path to innovation. Speaker: Olena Shu.
04/02, 10:00 am, CIS/CS, AMA (Ask me Anything) with MIT-Press-Machine-Learning-Books-Author, Prof. Ethem Alpaydın (Virtual) Please feel free to submit your questions via email or X. Speaker: Prof. Ethem Alpaydın, Ph.D.
04/02, 6:30 pm, SCV, Heat-Assisted Magnetic-Recording: Characterization of Media Properties (Hybrid) We will review the design and characterization of media used in heat-assisted magnetic recording (HAMR). Speaker: Dr. Pierre-Olivier Jubert.
04/02, 6:30 pm, TEMS, AI & The Future of Platform Engineering (Hybrid) Attendees will receive a comprehensive blueprint for safely managing the transition to AI-operated infrastructure, ensuring their systems remain highly intelligent and fundamentally incorruptible. Speaker: Ankush Sharma, Kunal Kannav.
04/04, 11:00am, CIS, Validating Quantum State Preparation Programs (Virtual) This talk will present the Quantum State Preparation Program Validation Framework (QSV). Speaker: Anshu Sharma.
04/07, 6:00 pm, SSIT, Future of Work in the Age of AI (Hybrid) We will explore the Future of Work with speakers who will address the technical and business workforce environment given the changes that have transpired with the increasing use of generative and agentic AI. Speaker: Claudionor Coelho, and others.
04/09, 12:30 pm, SPS, Towards Building Natural Conversational Agents (Virtual) I will present some of the recent progresses in building conversational agents, with a focus on the speech modality. Speaker: Dr. Dong Yu.
04/10, 12:00 pm, EPS, Using Architectural Simulation to Investigate Chiplets for Scalable and Cost Effective HPC Beyond Exascale (Virtual) Recently, the community has proposed several new standards to facilitate integration and interoperability of any compliant chiplet. Architectural modeling and simulation will play a critical role in pathfinding for this new potential direction for HPC beyond Exascale. Speaker: John Shalf.
04/10, 3:00 pm, CS/EPS, Characteristics of Successful Tech Hubs and Start-ups: Lessons for Engineers (San Jose) In this talk, the key Silicon Valley attributes will be illustrated and analyzed, for consideration by engineers interested in creating their own start-ups and high-tech businesses, working for them, or simply understanding them. Speaker: Paul Wesling.
04/14, 7:00 pm, CNSV, Conversational AI: Practical Challenges in Talking to People (Hybrid) In this talk, Elena Gostrer will examine these behaviors from a practical, product-engineering perspective. Speaker: Elena Gostrer.
04/15, 7:00 pm, EPS, Optical Sampling Thermoreflectance for 3D Heterogeneous Integration (Virtual) This session presents optical sampling thermoreflectance as a practical, commercially available solution, with real measurement data from a university lab and an industrial FA environment.
04/15, 7:00 pm, LMAG, Advancing Clean Energy: Ontario’s Darlington New Nuclear Project (DNNP) (Virtual) DNNP is at the forefront of deploying Small Modular Reactor (SMR) technology in Canada. The project will help meet rising electricity demand, advance electrification, and deliver reliable, carbon-free power. Speaker: Michael Takla.
4/16, 5:30 pm, IAS, Characterizing 2nd Law Efficiency of AI Datacenters (Pleasant Hill) We introduce an approach to quantify the transitional entropy generated during datacenter power fluctuations as a metric to evaluate datacenter performance using power demand measurements. Speaker: Ratnesh K Sharma, PhD, P.E.
4/21, 6:00 pm, PELS, APEC 2026 Download – Highlighting Evolving Landscape of Power Electronics (Santa Clara) The event will highlight emerging trends in wide bandgap semiconductors, advances in high-efficiency power conversion, AI-driven design optimization, and next-generation energy systems. Students are especially encouraged to attend.
4/22,11:00 am, LMAG, Quarterly social meeting and program (Livermore) Reserve this date for a social gathering and a program of general interest to be determined.
4/23, 11:30 am, NANO, Diamond Semiconductor Device Design & Fabrication (Sunnyvale) Diamond Quanta: making diamond as available as silicon. Speaker: Adam Khan.
4/25, 9:30 am, EPS, AdCom Meeting (APRIL 2026) (Virtual). If you want to join the meeting, contact the organizer mentioned in the link.
05/07, 12:00 pm, EPS, Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing, Virtual. The speaker will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. Speaker: Francesco Carobolante.
05/12, 5:00 pm, VTS, The Intelligence of the Machine.. The rigor of the road (Milpitas). This technical forum brings together OEMs, Tier-1 suppliers, semiconductor leaders, researchers, and innovators to address the challenge of fragmentation and define a unified, future-ready mobility stack. Students are especially encouraged to attend. Speakers: multiple see agenda.
05/19 8:00 am, EPS, Third Annual IEEE Build-Up Substrate Symposium (San Jose) This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. Speakers: multiple, see agenda.
05/25, 9:00 am, IEEE Canada Blockchain Forum 2026 (4th edition) (Virtual) The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Speakers: multiple see agenda.
Calendar View of IEEE Events
If you have missed an event search it in the calendar above and contact the organizing chapter for a life recording or look for it on the chapter‘s archive page.
Contact us, and learn more about volunteering opportunities in our sections.
Use “IEEE” (case sensitive) discount code to receive 50% off admission to the Computer History Museum. IEEE members will be asked to show proof of membership to redeem their discount when arriving at the Museum. Direct ticket link.
Sensor Converge 2026 discount. Secure your FREE Expo Hall Pass or an extra $100 off VIP / Conference Passes. Use code: IEEESCV200.
* Antenna and Propagation Society (APS) * Blockchain (BC) * Circuits & Systems Society (CASS) * Consultants’ Network of Silicon Valley (CNSV)* Consumer Technology Society (CTSoc) * Control Systems Society (CSS) * Communications Society (ComSoc) * Computer Society (CS)* Computational Intelligence Society (CIS) * Corporate Liaison Program (CLP) * Electron Devices Society (EDS) * Electronic Packaging Society (EPS) * Electromagnetic Compatibility (EMC) * Engineering In Medicine & Biology Society (EMBS) * Industry Applications Society (IAS) * Industry Engagement (IE) * Life Members Affinity Group (LMAG)* Magnetics Society (MAG) * MEMS & Sensors Council (MEMS) * Microwave Theory & Techniques (MTT) * Nanotechnology Council(NANO) * Nuclear & Plasma Sciences (NUE) * Photonics (PHOT)* Power & Energy Society (PES) & Industry Applications Society (IAS) * Power Electronics Society (PELS) * Product Safety Engineering (PSE) * Reliability (REL) * Robotics & Automation (RAS) * Silicon Valley Sustainability Chapter (SUST) * Signal Processing Society (SPS) * Silicon Valley Technology History Committee (SVTHC) * Society for Social Implications of Technology (SSIT) * Solid State Circuits Society (SSCS) * Startup Special Interest Group (SIG) * Student Branch (STB) * Technology and Engineering Management Society (TEMS) * Vehicular Technology Society (VTS) * Women In Engineering Affinity Group (WIE) * Young Professionals Affinity Group (YP)