#8/26 April 2026 – Subscribe the newsletter – Contact editor – Visit SFBAC – Join IEEE
Editor’s Recommendations
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Where Innovation Meets Impact
Sensors Converge is North America’s largest event where sensing, processing, and connectivity converge to shape the future of intelligent systems.
At Sensors Converge, your mission is simple: design smarter technologies, accelerate development, and power the next generation of intelligent electronics.
Explore advancements across edge computing, IoT, MEMS, power systems, embedded design, and AI-driven engineering – all under one roof.
Registration has started. Secure your FREE Expo Hall Pass or an extra $100 off VIP / Conference Passes. Use code: IEEESCV200.
On the 2026 expo floor, your products don’t just get seen — they get tested, discussed, compared, and adopted. Request more information
Sensors Converge May 5-7, 2026 Santa Clara Convention Center
DAC: The Premier Event for Chips to Systems
July 26 – 29, 2026 | Long Beach Convention Center
For over 60 years, DAC has been the heartbeat of the semiconductor ecosystem. Join us for four days of world-class training, cutting-edge research, and unparalleled networking with the industry’s leading designers, researchers, and vendors.
From AI and EDA to Security and Systems, DAC focuses on the latest methodologies driving the future of electronic design. Whether you are looking to sharpen your skills through technical training or connect with tool developers and practitioners, DAC 63 is where the industry’s future is built.
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04/15, 7:00 pm, EPS, Optical Sampling Thermoreflectance for 3D Heterogeneous Integration (Virtual) This session presents optical sampling thermoreflectance as a practical, commercially available solution, with real measurement data from a university lab and an industrial FA environment.
04/15, 7:00 pm, LMAG, Advancing Clean Energy: Ontario’s Darlington New Nuclear Project (DNNP) (Virtual) DNNP is at the forefront of deploying Small Modular Reactor (SMR) technology in Canada. The project will help meet rising electricity demand, advance electrification, and deliver reliable, carbon-free power. Speaker: Michael Takla.
4/17, 6:30 pm, SPS, The state of video compression standards: strong, dynamic, and embracing deep learning-based technologies (Santa Clara) We will start present the two most recent video compression standards: AV1 and VVC and continue discussing new deep learning-based video compression technologies. Speaker: Dr Iole Moccagatta.
4/21, 6:00 pm, PELS, APEC 2026 Download – Highlighting Evolving Landscape of Power Electronics (Santa Clara) The event will highlight emerging trends in wide bandgap semiconductors, advances in high-efficiency power conversion, AI-driven design optimization, and next-generation energy systems. Students are especially encouraged to attend.
4/22,11:00 am, LMAG, California Historical Radio Society (Livermore) We will discuss the work being done to preserve the technologies and stories that shaped modern electronic communication. This presentation offers a fast-paced visual tour of the CHRS Museum in Alameda. Speaker: Rachel Lee.
4/22, 6:00 pm, WIE, The Engineer’s Guide to AI Strategy: Bridging the Gap Between Business and Technical Reality (Virtual) In this session, we will explore how engineers must evolve from execution-focused contributors to strategic decision-makers, integrating governance and strategy as core technical requirements in AI system design. Speaker: Kierra Dotson.
4/23, 11:30 am, NANO, Diamond Semiconductor Device Design & Fabrication (Sunnyvale) Diamond Quanta: making diamond as available as silicon. Speaker: Adam Khan.
4/23, 5:30 pm, IAS, Characterizing 2nd Law Efficiency of AI Datacenters (Pleasant Hill) We introduce an approach to quantify the transitional entropy generated during datacenter power fluctuations as a metric to evaluate datacenter performance using power demand measurements. Speaker: Ratnesh K Sharma, PhD, P.E.
4/24,11:45am, EDS, Robustness and Reliability of Wide Bandgap Power Semiconductors ( Virtual) Wide bandgap devices are increasingly penetrating the automotive market. Application of WBG devices like SiC MOSFETs and GaN power devices in automotive applications requires understanding of the reliability and qualification procedures especially according to the automotive standard. Speaker: Dr. Layi Alatise.
4/25, 9:30 am, EPS, AdCom Meeting (APRIL 2026) (Virtual). If you want to join the meeting, contact the organizer mentioned in the link.
05/01,11:00 am, EPS, Reliability Modeling Approaches: Physics or AI/ML (Virtual) This presentation provides a high-level description of CALCE-UMD activities in reliability physics of microelectronic systems, starting with a brief history and continuing on to recent trends in multiscale modeling of the reliability of advanced microelectronic packaging. Speaker: Prof. Abhijit Dasgupta.
05/06, 6:30 pm, SCV, IEEE SCV Networking Event at the Sensors Converge 2026 (Santa Clara) IEEE SCV Section invites all professionals and members attending Sensors Converge to an exclusive evening of networking and industry connection. See you there!
05/07, 12:00 pm, EPS, Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing, Virtual. The speaker will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. Speaker: Francesco Carobolante.
05/07, 6:30 pm, TEMS, Effective Networking: Grow Your Circles of Influence (Santa Clara) Networking expert Cesar Plata will lead us through a dynamic, interactive session where we will practice proven techniques to expand your professional reach. Speaker: Cesar Plata.
05/12, 5:00 pm, VTS, The Intelligence of the Machine.. The rigor of the road (Milpitas). This technical forum brings together OEMs, Tier-1 suppliers, semiconductor leaders, researchers, and innovators to address the challenge of fragmentation and define a unified, future-ready mobility stack. Students are especially encouraged to attend. Speakers: multiple see agenda.
05/14, 3:45 pm, SCV, IEEE Milestone Dedication: MIS‑1 at El Camino Hospital (Hybrid) Honoring the historic collaboration between Lockheed and El Camino Hospital that revolutionized the field of medical informatics.
05/19 8:00 am, EPS, Third Annual IEEE Build-Up Substrate Symposium (San Jose) This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. Speakers: multiple, see agenda.
05/25, 9:00 am, IEEE Canada Blockchain Forum 2026 (4th edition) (Virtual) The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Speakers: multiple see agenda.
06/05, 12:00 pm, WIE, Human System Engineering Initiatives: From Human Views to Human Readiness Levels (Virtual) This talk discusses the role of Human System Engineering within the System Engineering discipline. Current standards and applications will be included. Speaker: Dr. Holly A. H. Handley.
Calendar View of IEEE Events
If you have missed an event search it in the calendar above and contact the organizing chapter for a life recording or look for it on the chapter‘s archive page.
Contact us, and learn more about volunteering opportunities in our sections.
Use “IEEE” (case sensitive) discount code to receive 50% off admission to the Computer History Museum. IEEE members will be asked to show proof of membership to redeem their discount when arriving at the Museum. Direct ticket link.
Sensor Converge 2026 discount. Secure your FREE Expo Hall Pass or an extra $100 off VIP / Conference Passes. Use code: IEEESCV200.
* Antenna and Propagation Society (APS) * Blockchain (BC) * Circuits & Systems Society (CASS) * Consultants’ Network of Silicon Valley (CNSV)* Consumer Technology Society (CTSoc) * Control Systems Society (CSS) * Communications Society (ComSoc) * Computer Society (CS)* Computational Intelligence Society (CIS) * Corporate Liaison Program (CLP) * Electron Devices Society (EDS) * Electronic Packaging Society (EPS) * Electromagnetic Compatibility (EMC) * Engineering In Medicine & Biology Society (EMBS) * Industry Applications Society (IAS) * Industry Engagement (IE) * Life Members Affinity Group (LMAG)* Magnetics Society (MAG) * MEMS & Sensors Council (MEMS) * Microwave Theory & Techniques (MTT) * Nanotechnology Council(NANO) * Nuclear & Plasma Sciences (NUE) * Photonics (PHOT)* Power & Energy Society (PES) & Industry Applications Society (IAS) * Power Electronics Society (PELS) * Product Safety Engineering (PSE) * Reliability (REL) * Robotics & Automation (RAS) * Silicon Valley Sustainability Chapter (SUST) * Signal Processing Society (SPS) * Silicon Valley Technology History Committee (SVTHC) * Society for Social Implications of Technology (SSIT) * Solid State Circuits Society (SSCS) * Startup Special Interest Group (SIG) * Student Branch (STB) * Technology and Engineering Management Society (TEMS) * Vehicular Technology Society (VTS) * Women In Engineering Affinity Group (WIE) * Young Professionals Affinity Group (YP)