#22/25 November 2025 – Subscribe the newsletter – Contact editor – Visit SFBAC – Join IEEE
Editor’s Recommendations
Last chance to submit to DAC ’26. Use the opportunity to submit a paper to ISQED’26. The submission deadline has been prolonged. Effective Training is offering a new course, and SVEC has the yearly Open House event. Don’t miss the IEEE EPS symposium Reliability for Packaging.
Job Opportunity
DTN Engineers Inc in Milpitas needs two full time electrical CAD drafters/designers, 2 to 3 years experience to do single-lines, control diagrams and floor plans. Contact us: diep@ieee.org
Master Presentation Skills with AI
Where Human Presence Meets Artificial Intelligence to Create Powerful, Persuasive Communicators
Mastering Presentation Excellence with AI blends proven in-person and virtual delivery techniques with AI-enabled tools to elevate clarity, impact, and engagement. The program includes a proven foundational presentation principles with best practices and hands-on AI application, ensuring participants can streamline preparation, personalize messaging, and deliver with confidence.
Key Topics:
- Clarify audience needs quickly by using AI to tailor tone, relevance, and messaging
- Craft stronger calls to action and key messages using AI to sharpen presentation outcomes and content
- Increase engagement and retention through AI-supported openings, stories, and prompts
- Present with greater executive presence by enhancing vocal delivery, visual focus, and structure
- Recognize the key differences and challenges of presenting virtually versus in person
- Streamline slide design and prep time using AI to refine content flow, visuals, and clarity
- Anticipate questions and objections using AI and learn engagement strategies for tough Q&A
Effective Training Associates, located in Silicon Valley, provides global training programs for engineers and managers in the high-tech industry. For more information on the public schedule or private classes please contact Laura Hickerson. or phone us at 408.441.8881
Don‘t miss SVEC Open House Event with the topic New Pathway to Improve Healthcare on November 18th. To learn more and register follow the link.
The 27th International Symposium on Quality Electronic Design (ISQED’25)
ISQED’26 stands as the leading conference at the intersection of multiple disciplines within electronic design. A pioneer and leading multidisciplinary conference, ISQED accepts and promotes papers related to the manufacturing, design and EDA. The Call for Papers is open. ISQED is soliciting proposals for special sessions. These should aim at offering a complementary experience to the regular sessions and are of general interest to the audience of ISQED. Ongoing research projects can be presented at ISQED under the Work in Progress (WIP) category. This provides a unique opportunity to authors to receive early feedback on their current work. All past Conference proceedings & Papers have been published in IEEE Xplore digital library and indexed by Scopus.
Don’t miss the opportunity to participate. Paper submission has been extended to November 17th.
DAC 2026 Conference – Call for Contributions
Long Beach Convention Center, CA, July 25-29, 2025.
DAC is the premier conference for the design and automation of electronic circuits and systems. Submit to DAC 2026 and be part of tomorrow’s innovation. Focus areas are: AI, Design, EDA, Systems and Security. If you are in the electronic design field, this is the NOT TO MISS event.
Call for Contribution deadline: November 18th.
IEEE Local Chapter Events
11/19, 6:00 pm, MTTS, Stability & Biasing in mmWave GaAs/GaN PAs: Challenges and Solutions, Hybrid. This talk will focus on design considerations unique to mmWave GaAs and GaN PAs, with particular emphasis on stability and biasing challenges at frequencies above 20 GHz. Speaker: Dr. Asmita Dani.
11/20, 7:30 am, EPS, IEEE Symposium on Reliability for Electronics and Photonics Packaging, Hybrid. This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. Speakers: multiple, see agenda.
11/20, 5:30 pm, IAS, Modernizing Power System Design with IEC 61850: Breaking Free from Hardware Constraints, Pleasant Hill. This presentation explores how embracing IEC 61850, a globally recognized standard for power system communication and configuration, can unlock new efficiencies. Speaker: Darren De Ronde.
12/4, 12:00 pm, EPS, Characterization and Application of a New Chip-Level Air Pump, Virtual. µCooling: A new device has been invented that changes the way thermal engineers are approaching system cooling design. µCooling is a new concept in air movers. It is small, and thin and is a complete departure from rotating mass fans. Speaker: Tom Tarter.
12/4, 6:30 pm, TEMS, Navigating your Career: Lessons Learned and Success Strategies, Hybrid. In this talk, I’ll share lessons learned from my own journey and from others who’ve navigated career twists, pauses, and pivots. Speaker: Jill Gostin.
12/9, 6:30 pm, CNSV, Size Really Does Matter: Biological Nanoparticles Are Changing Biomedicine, Hybrid. In this talk, will discuss the challenges, and the promise, of exosomes in biomedical diagnostics. Speaker: Dr. Giacomo Vacca.
12/11, 9:00 am, EPS, AI for Thermal Management of Electronic Systems: A Pathway to Digital Twins, Virtual. In this talk, I will present recent and ongoing research activities at ES2 Binghamton on AI-enabled thermal management design, with emphasis on cooling solutions for high-power chips in data centers. Speaker: Srikanth Rangarajan.
12/11, 12:00 pm, EPS, Digital Lithography: Addressing Scaling Challenges in Advanced Packaging, Virtual. The talk will preview Applied Materials’ Digital Lithography Technology (DLT) which enables highest resolution at production throughputs while ensuring CD uniformity and overlay accuracy across the entire panel. Speaker: Niranjan Khasgiwale.
01/22/2026, 8:00 am, EPS, IEEE/EPS Hybrid Bonding Symposium, Milpitas. Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design. Speakers: multiple, see event link.
Calendar View of IEEE Events
If you have missed an event search it in the calendar above and contact the organizing chapter for a life recording or look for it on the chapter‘s archive page.
Join one of our local chapters and get involved with the latest trends in technology. Pick your chapter!
IEEE Entrepreneurship Hard Tech Venture Summit Organizing Committee is looking for volunteers and advisors The event is planned in the Bay Area in February 2026. For more details please contact Bruno lafelice at bruno@tvlp.co
Use “IEEE” (case sensitive) discount code to receive 50% off admission to the Computer History Museum. IEEE members will be asked to show proof of membership to redeem their discount when arriving at the Museum. Direct ticket link.
IEEE Member discount available at the TechEquity Ai Summit 2025 | Silicon Valley on November 7-8 in Sunnyvale. IEEECODE-80: 80% Discount Code— Conference Pass; IEEEWORKSHOPS15: 15% off discount for our Workshops
* Antenna and Propagation Society (APS) * Blockchain (BC) * Circuits & Systems Society (CASS) * Consultants’ Network of Silicon Valley (CNSV)* Consumer Technology Society (CTSoc) * Control Systems Society (CSS) * Communications Society (ComSoc) * Computer Society (CS)* Computational Intelligence Society (CIS) * Corporate Liaison Program (CLP) * Electron Devices Society (EDS) * Electronic Packaging Society (EPS) * Electromagnetic Compatibility (EMC) * Engineering In Medicine & Biology Society (EMBS) * Industry Applications Society (IAS) * Industry Engagement (IE) * Industry Hub (IIH) * Instrumentation & Measurement Society (IMS) * Life Members Affinity Group (LMAG)* Magnetics Society (MAG) * MEMS & Sensors Council (MEMS) * Microwave Theory & Techniques (MTT) * Nanotechnology Council(NANO) * Nuclear & Plasma Sciences (NUE) * Photonics (PHOT)* Power & Energy Society (PES) & Industry Applications Society (IAS) * Power Electronics Society (PELS) * Product Safety Engineering (PSE) * Reliability (REL) * Robotics & Automation (RAS) * Silicon Valley Sustainability Chapter (SUST) * Signal Processing Society (SPS) * Silicon Valley Technology History Committee (SVTHC) * Society for Social Implications of Technology (SSIT) * Solid State Circuits Society (SSCS) * Startup Special Interest Group (SIG) * Student Branch (STB) * Technology and Engineering Management Society (TEMS) * Vehicular Technology Society (VTS) * Women In Engineering Affinity Group (WIE) * Young Professionals Affinity Group (YP)