#20/25 October 2025 – Subscribe the newsletter – Contact editor – Visit SFBAC – Join IEEE
Editor’s Recommendations
SF Bay ACM Chapter, is announcing two events in November. Don’t miss the incredible job opportunity with DTN Engineers. Interested in becoming a Trusted Advisor, have a look at the training section. Learn the latest about Brain Machine Interface or join the virtual Cyber Security WS, Building a Safer Digital World both events organized by the local IEEE chapters.
Job Opportunity
DTN Engineers Inc in Milpitas needs two full time electrical CAD drafters/designers, 2 to 3 years experience to do single-lines, control diagrams and floor plans. Contact us: diep@ieee.org
Elevate Your Role as a Customer-Facing Engineer
Become a Trusted Advisor:
This course helps technical professionals transition from problem solvers to strategic partners by developing the mindset and skills needed for lasting customer relationships.
Key Topics:
- Value of a customer-centric approach
- Building trust for effective communication
- Identifying and addressing trust issues
- When to influence versus convince
- Balancing inquiry and advocacy in conversations
- Setting realistic expectations
- Adapting communication styles
- Managing escalations
- Applying a proven model for Trusted Advisor skills
Effective Training Associates, located in Silicon Valley, provides global training programs for engineers and managers in the high-tech industry. For more information on the public schedule or private classes please contact Laura Hickerson. or phone us at 408.441.8881
Monday, November 10, 5:30 pm to 7:30 pm, Accelerating Startups to Put Enterprise GenAI Multi-Agent Systems in Production.
Saturday and Sunday, November 15/16, Towards Agentic Intelligence: Architectures for Multi-Agent AI Systems.
The 27th International Symposium on Quality Electronic Design (ISQED’25)
ISQED’26 stands as the leading conference at the intersection of multiple disciplines within electronic design. A pioneer and leading multidisciplinary conference, ISQED accepts and promotes papers related to the manufacturing, design and EDA. The Call for Papers is open. ISQED is soliciting proposals for special sessions. These should aim at offering a complementary experience to the regular sessions and are of general interest to the audience of ISQED. Ongoing research projects can be presented at ISQED under the Work in Progress (WIP) category. This provides a unique opportunity to authors to receive early feedback on their current work. All past Conference proceedings & Papers have been published in IEEE Xplore digital library and indexed by Scopus.
Don’t miss the opportunity to participate. Paper submission has been extended to October 25th.
DAC 2026 Conference – Call for Contributions
Long Beach Convention Center, CA, July 25-29, 2025.
DAC is the premier conference for the design and automation of electronic circuits and systems. Submit to DAC 2026 and be part of tomorrow’s innovation. Focus areas are: AI, Design, EDA, Systems and Security. If you are in the electronic design field, this is the NOT TO MISS event.
Call for Contribution deadline: November 11th.
IEEE Local Chapter Events
10/15, 11:00 am, LMAG, Quarterly Social Meeting and Program, Livermore. See event link for details.
10/16, 7:00 am, IAS, VENDOR TABLE for Grounding and Ground Fault Protection Seminar Pleasanton. Vendor table will be one 6-foot exhibit table. Vendor table includes one (1) attendee ticket. A power strip will be available upon request.
10/16, 7:00 am, IAS, Grounding and Ground Fault Protection Seminar, Pleasanton. This one-day Technical Seminar will cover the fundamentals of grounding, bonding, and ground fault protection. The seminar will serve as a primer for engineers and a refresher for experienced engineers. Speakers: see agenda.
10/16, 11:30 am, NANO, Next Generation Two-photon 3D Printing Technologies, Sunnyvale. Utilizing a suite of additive manufacturing technologies for applications in responsive and architected materials, energy storage, carbon recycling, microfluidics, quantum computing, and inertial confinement fusion. Speaker: Sr. Xiaoxing Xia.
10/16, 5:30 pm, SSCS, AI- Enhanced RF/Mixed-Signal Circuits for Reliable Operations, Stanford. The presentation will highlight AI-enhanced designs such as adaptive power amplifiers, PMICs, and multispectral sensors that enhance performance and reliability in harsh environments. Speaker: Vanessa Chen, PhD.
10/22, 4:15pm, CIS/CS, Twin talks: Enterprise scale GenAI and Securing Agentic AI, San Jose. This event brings together leading industry experts to address both sides of this equation. Speakers: Mrinal Karvir, Dewank Pant.
10/23, 12:00 pm, EPS, The Evolution and Emerging role of Solder Joints in AI and High-Performance , Virtual. This seminar revisits the fundamentals of solder joint evolution, exploring why it has been so effective for thirty years and the inherent limitations now emerging. . Speaker(s): Tae-Kyu Lee.
10/23 12:00 pm, CTSoc/EMBS, Brain Machine Interface: Challenges and Opportunities Virtual. Next-generation brain machine interfaces will benefit from an implantable neural recording IC. To meet design targets an architectural paradigm shift is needed. This talk, we will delve into specific challenges to achieve intended targets. Speaker: Dr. Dante G. Muratore.
10/25, 9:00 am, CS, Sixth Annual LA IEEE Coastal LA CS Cyber Security Summit 2-25- South Bay, Virtual. Theme, Secure Together: Building a Safer Digital World. Speakers: multiple, details in the agenda.
11/7, 11:45 am, EDS, From Mg to Be: Rethinking P-Type Doping Strategies in Wide-Bandgap III-Nitrides, Virtual. Our recent work explores beryllium as an alternative acceptor in (Al,Ga)N, leveraging metal-organic chemical vapor deposition (MOCVD) to achieve high-quality, low-defect epitaxial growth. Speaker: Dr. F. Shadi Shahedipour-Sandvik.
11/12, 5:00 pm, CS, AMA (Ask me Anything) with Distinguished Lecturer, Prof. Alice Smith, Virtual. Send your questions in advance when registering. Speaker: Prof Alice Smith.
11/13, 11:30 am, NANO, Rethink Chip Design to deliver Faster, Smarter, More Compact Solutions, Sunnyvale. Our foundational innovations in advanced materials and semiconductor integration unlock unprecedented gains in performance, efficiency, and scalability. Speaker: Jiadi Zhu.
11/13, 12:00 pm, EPS, AI-Enhanced Multimodal Approaches for Electronics Metrology and Failure Analysis. Virtual. The rapid growth of 3D advanced packaging introduces new challenges in inspection and failure analysis. Our work advances an AI-powered multimodal inspection framework that couples physics-informed machine learning with structured data infrastructure. Speaker: Dr. Navid Asadi.
11/19, 6:00 pm, MTTS, Stability & Biasing in mmWave GaAs/GaN PAs: Challenges and Solutions, Hybrid. This talk will focus on design considerations unique to mmWave GaAs and GaN PAs, with particular emphasis on stability and biasing challenges at frequencies above 20 GHz. Speaker: Dr. Asmita Dani.
11/20, 7:30 am, EPS, IEEE Symposium on Reliability for Electronics and Photonics Packaging, Hybrid. This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. Speakers: multiple, see agenda.
11/20, 5:30 pm, IAS, Modernizing Power System Design with IEC 61850: Breaking Free from Hardware Constraints, Pleasant Hill. This presentation explores how embracing IEC 61850, a globally recognized standard for power system communication and configuration, can unlock new efficiencies. Speaker: Darren De Ronde.
12/4, 12:00 pm, EPS, Characterization and Application of a New Chip-Level Air Pump, Virtual. µCooling: A new device has been invented that changes the way thermal engineers are approaching system cooling design. µCooling is a new concept in air movers. It is small, and thin and is a complete departure from rotating mass fans. Speaker: Tom Tarter.
12/11, 9:00 am, EPS, AI for Thermal Management of Electronic Systems: A Pathway to Digital Twins, Virtual. In this talk, I will present recent and ongoing research activities at ES2 Binghamton on AI-enabled thermal management design, with emphasis on cooling solutions for high-power chips in data centers. Speaker: Srikanth Rangarajan.
12/11, 12:00 pm, EPS, Digital Lithography: Addressing Scaling Challenges in Advanced Packaging, Virtual. The talk will preview Applied Materials’ Digital Lithography Technology (DLT) which enables highest resolution at production throughputs while ensuring CD uniformity and overlay accuracy across the entire panel. Speaker: Niranjan Khasgiwale.
Calendar View of IEEE Events
If you have missed an event search it in the calendar above and contact the organizing chapter for a life recording or look for it on the chapter‘s archive page.
Join one of our local chapters and get involved with the latest trends in technology. Pick your chapter!
IEEE Entrepreneurship Hard Tech Venture Summit Organizing Committee is looking for volunteers and advisors The event is planned in the Bay Area in February 2026. For more details please contact Bruno lafelice at bruno@tvlp.co
Use “IEEE” (case sensitive) discount code to receive 50% off admission to the Computer History Museum. IEEE members will be asked to show proof of membership to redeem their discount when arriving at the Museum. Direct ticket link.
IEEE Member Discount to “Legends of Engineering for a roundtable discussion” IEEE members use the coupon code: SVECSOCIETY15. For more details follow this link
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