#21/25 November 2025 – Subscribe the newsletter – Contact editor – Visit SFBAC – Join IEEE
Editor’s Recommendations
The TechEquity AI Summit presents an incredible opportunity for IEEE members to enjoy exclusive discounts, enhancing your professional development and networking potential in the rapidly evolving field of technology. As we approach the DAC ’26 submission deadline, it’s crucial to act swiftly—this is your chance to showcase your work and gain recognition in the engineering community! Dive into the latest innovative methods for modeling and designing electronic systems, particularly focusing on emissions, and stay ahead of the curve by exploring the significant role AI plays in electronic metrology and failure analysis.
Job Opportunity
DTN Engineers Inc in Milpitas needs two full time electrical CAD drafters/designers, 2 to 3 years experience to do single-lines, control diagrams and floor plans. Contact us: diep@ieee.org
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Effective Training Associates, located in Silicon Valley, provides global training programs for engineers and managers in the high-tech industry. For more information on the public schedule or private classes please contact Laura Hickerson. or phone us at 408.441.8881
Join TechEquity Ai Summit 2025 | Silicon Valley on November 7-8 in Sunnyvale. IEEE Member discount available. IEEECODE-80: 80% Discount Code— Conference Pass; IEEEWORKSHOPS15: 15% off discount for our Workshops
Monday, November 10, 5:30 pm to 7:30 pm, Accelerating Startups to Put Enterprise GenAI Multi-Agent Systems in Production.
Saturday and Sunday, November 15/16, Towards Agentic Intelligence: Architectures for Multi-Agent AI Systems.
The 27th International Symposium on Quality Electronic Design (ISQED’25)
ISQED’26 stands as the leading conference at the intersection of multiple disciplines within electronic design. A pioneer and leading multidisciplinary conference, ISQED accepts and promotes papers related to the manufacturing, design and EDA. The Call for Papers is open. ISQED is soliciting proposals for special sessions. These should aim at offering a complementary experience to the regular sessions and are of general interest to the audience of ISQED. Ongoing research projects can be presented at ISQED under the Work in Progress (WIP) category. This provides a unique opportunity to authors to receive early feedback on their current work. All past Conference proceedings & Papers have been published in IEEE Xplore digital library and indexed by Scopus.
Don’t miss the opportunity to participate. Paper submission has been extended to October 25th.
DAC 2026 Conference – Call for Contributions
Long Beach Convention Center, CA, July 25-29, 2025.
DAC is the premier conference for the design and automation of electronic circuits and systems. Submit to DAC 2026 and be part of tomorrow’s innovation. Focus areas are: AI, Design, EDA, Systems and Security. If you are in the electronic design field, this is the NOT TO MISS event.
Call for Contribution deadline: November 11th.
IEEE Local Chapter Events
11/4, 8:30 am, EMC, 2025 Silicon Valley Area Workshop on EMC Design of High-Speed Systems, San Jose. Speakers will present some of the latest methods for modeling and design of electronic systems for emissions, electrostatic discharge, and SI/PI, as well as address many of the challenges involved in developing next-generation digital systems. Speakers: multiple see agenda.
11/4, 6:00 pm, CSS, Prescriptive Maintenance in Semiconductor Manufacturing: A Shift from Reactive to Intelligent Systems, Hybrid. Semiconductor Tool maintenance is a complex task due to process complexity, process integration challenges, and customer requirements. This discussion will cover some of the challenges and solutions to this framework. Speaker: Michael Armacost.
11/6, 5:30 pm, CS, IEEE x Leonis Capital AI Safety Mixer, San Francisco. Join us for an evening of AI safety talks and conversations, and get to know researchers and practitioners working on some of the most important safety challenges of our time! Speakers: multiple, see agenda for details.
11/7, 11:45 am, EDS, From Mg to Be: Rethinking P-Type Doping Strategies in Wide-Bandgap III-Nitrides, Virtual. Our recent work explores beryllium as an alternative acceptor in (Al,Ga)N, leveraging metal-organic chemical vapor deposition (MOCVD) to achieve high-quality, low-defect epitaxial growth. Speaker: Dr. F. Shadi Shahedipour-Sandvik.
11/11, 7:00 pm, PSE, Product Safety and Compliance Meetup, Virtual. We will discuss the future of the chapter and plan future events. Speakers: chapter members.
11/11, 7:00 pm, CNSV Bell Labs’ Critical BELLMAC-32 Microprocessor Legacy, Hybrid. This presentation will discuss the pioneering microprocessor R&D efforts at Bell Labs in 1976-1982 which created a new chip architecture and physical design. Speaker: Michael Condry, Sung (Steve) Mo Kang , Victor Huang.
11/12, 5:00 pm, CS, AMA (Ask me Anything) with Distinguished Lecturer, Prof. Alice Smith, Virtual. Send your questions in advance when registering. Speaker: Prof Alice Smith.
11/13, 11:30 am, NANO, Rethink Chip Design to deliver Faster, Smarter, More Compact Solutions, Sunnyvale. Our foundational innovations in advanced materials and semiconductor integration unlock unprecedented gains in performance, efficiency, and scalability. Speaker: Jiadi Zhu.
11/13, 12:00 pm, EPS, AI-Enhanced Multimodal Approaches for Electronics Metrology and Failure Analysis. Virtual. The rapid growth of 3D advanced packaging introduces new challenges in inspection and failure analysis. Our work advances an AI-powered multimodal inspection framework that couples physics-informed machine learning with structured data infrastructure. Speaker: Dr. Navid Asadi.
11/14, 10:00 am, EMC, EMC for Missiles, Virtual. From environments to requirements to best practices, this presentation will discuss key focuses of EMI/EMC engineering in relation to missile programs and systems and how best to achieve success. Speakers: Flynn Lawrence.
11/19, 6:00 pm, MTTS, Stability & Biasing in mmWave GaAs/GaN PAs: Challenges and Solutions, Hybrid. This talk will focus on design considerations unique to mmWave GaAs and GaN PAs, with particular emphasis on stability and biasing challenges at frequencies above 20 GHz. Speaker: Dr. Asmita Dani.
11/20, 7:30 am, EPS, IEEE Symposium on Reliability for Electronics and Photonics Packaging, Hybrid. This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. Speakers: multiple, see agenda.
11/20, 5:30 pm, IAS, Modernizing Power System Design with IEC 61850: Breaking Free from Hardware Constraints, Pleasant Hill. This presentation explores how embracing IEC 61850, a globally recognized standard for power system communication and configuration, can unlock new efficiencies. Speaker: Darren De Ronde.
12/4, 12:00 pm, EPS, Characterization and Application of a New Chip-Level Air Pump, Virtual. µCooling: A new device has been invented that changes the way thermal engineers are approaching system cooling design. µCooling is a new concept in air movers. It is small, and thin and is a complete departure from rotating mass fans. Speaker: Tom Tarter.
12/11, 9:00 am, EPS, AI for Thermal Management of Electronic Systems: A Pathway to Digital Twins, Virtual. In this talk, I will present recent and ongoing research activities at ES2 Binghamton on AI-enabled thermal management design, with emphasis on cooling solutions for high-power chips in data centers. Speaker: Srikanth Rangarajan.
12/11, 12:00 pm, EPS, Digital Lithography: Addressing Scaling Challenges in Advanced Packaging, Virtual. The talk will preview Applied Materials’ Digital Lithography Technology (DLT) which enables highest resolution at production throughputs while ensuring CD uniformity and overlay accuracy across the entire panel. Speaker: Niranjan Khasgiwale.
01/22/2026, 8:00 am, EPS, IEEE/EPS Hybrid Bonding Symposium, Milpitas. Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design. Speakers: multiple, see event link.
Calendar View of IEEE Events
If you have missed an event search it in the calendar above and contact the organizing chapter for a life recording or look for it on the chapter‘s archive page.
Join one of our local chapters and get involved with the latest trends in technology. Pick your chapter!
IEEE Entrepreneurship Hard Tech Venture Summit Organizing Committee is looking for volunteers and advisors The event is planned in the Bay Area in February 2026. For more details please contact Bruno lafelice at bruno@tvlp.co
Use “IEEE” (case sensitive) discount code to receive 50% off admission to the Computer History Museum. IEEE members will be asked to show proof of membership to redeem their discount when arriving at the Museum. Direct ticket link.
IEEE Member discount available at the TechEquity Ai Summit 2025 | Silicon Valley on November 7-8 in Sunnyvale. IEEECODE-80: 80% Discount Code— Conference Pass; IEEEWORKSHOPS15: 15% off discount for our Workshops
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