#6/26 March 2026 – Subscribe the newsletter – Contact editor – Visit SFBAC – Join IEEE
Editor’s Recommendations
ISQED ’26 begins in one month, and registration is now open. Additionally, registration for the CASPA Spring Symposium is live—don’t miss this opportunity to attend. Join the NANO chapter to explore the latest trends in synthetic DNA.
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CASPA 2026 Spring Symposium: “Paving the AI Super-Highway: Rethinking Memory and Storage at Scale” Join us on March 21st to explore the future of AI infrastructure. Register & Event Details.
The 27th ISQED Conference April 8-10, 2026
Registration is now open for the 27th International Symposium on Quality Electronic Design (ISQED), taking place April 8-10, 2025. ISQED is the leading conference for design for manufacturability (DFM) and quality (DFQ) issues. As the leading event in the field, it is your chance to network with top experts across the electronics and semiconductor ecosystem. Register today!
Hard Tech Venture Summit Silicon Valley
April 16-17, 2026 – SRI, Menlo Park
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A premier, curated event for Hard Tech ecosystem |
Last year attendees’ experience.
Hard Tech might be hard—but IEEE has the summit to help.
- Capital from Hard Tech–focused venture funds.
- Mentorship from manufacturing experts.
- Strategy through the Hard Tech FOCUS framework.
IEEE Energy Conversion Congress & Expo
Convention Center, Vancouver, BC,
October 4-8, 2026.
ECCE 2026 is the pivotal international conference and exposition event on the electrical and electromechanical energy conversion field. The Conference will bring together practicing engineers, researchers, and other professionals for interactive and multidisciplinary discussions on the latest advances in various areas related to energy conversion.
Call for Papers is open. Focus areas are : component, converter and subsystem technologies and energy conversion systems and applications. Submission deadline extended to March 13 th. For details visit out submission web page.
IEEE Local Chapter Events
03/16, 10:00 am | PES – IEEE & Eaton Corporation Info Session (Hybrid) Interested in power systems? Join IEEE and Eaton Corporation for an informative session. Speaker: Philip Delosreyes.
03/18, 4:45 pm | CIS/CS – Chapter Open House: AI Infrastructure (Hybrid) Explore why modern AI clusters utilize hardware offloads like RDMA to achieve high throughput and low latency for GPU-to-GPU communication. Speakers: Sujithra Periasamy, Dr. Vishnu S. Pendyala.
03/19, 11:30 am | NANO – Silicon Metasurfaces for DNA Synthesis, (Sunnyvale) Introducing B-MOS (Metasurface Oligonucleotide Synthesizer for Engineered Biology), a novel platform integrating silicon nanophotonics with solid-phase DNA synthesis. Speaker: Dr. Punnag Padhy.
3/19, 5:30 pm, IAS, Understanding Tier 4 Emissions for Generator Sets (Pleasant Hill) This presentation will offer insights on how to design a reliable system that meets local and national code requirements. Speaker; Shen Yoon.
3/20, 11:45 am, EDS, A device to circuit framework for BTI, HCD aging (Virtual)In this talk we will propose a physics based device aging framework and its implementation in a circuit aging simulation platform. Speaker: Dr. Souvik Mahapatra.
03/23, 6:00 pm, MTT, Edge AI Meets Wireless Systems: Implications for Connectivity, Architecture, and RF Design (Hybrid) In this talk, I will discuss how emerging Edge AI workloads challenge long-standing assumptions in wireless and RF system design. Speaker: Dr. Roberto Morabito.
03/26, 12:00 pm, EPS, Co-Packaged Optics: Heterogeneous Integration of Chiplets in Switches, Photonic ICs and Electronic ICs (Virtual) In the next few years, we will see more implementations of a higher level of heterogeneous integration of switch, PIC and EIC, whether it is for performance, form factor, power consumption or cost. Speaker: John Lau.
03/27, 9:00 am, OEB, Spring STEM Workshop: Team Race Car Building (Hayward) Come join our Spring STEM Youth Workshop where you’ll get hands-on experience with build a car servos, learn the mechanics behind it and race an obstacle course/ track! Registration closes March 23.
03/27, 6:00 pm, WIE, Designing Your Early Career: LinkedIn, Resume & Interview Strategy That Works (Virtual) In this practical and engaging session, students and early-career professionals can learn to strategically present their academic work, projects, internships, and experiences to stand out. Speaker: Shima Ghaheri.
03/28, 9:00 am, EPS, AdCom Meeting (Virtual) Get involved and join our regular chapter meetings.
03/28, 12:00 pm, YP, Leadership Hike (Hayward) Hike at Green Belt Trail with Leadership Workshop, followed by lunch provided at Buffalo Bills.
04/01,5:30 pm, EMC, Augmented Intelligence for End-to-End Design (San Jose) In this talk, I will share practical examples and key insights from several years of applying Augmented Intelligence to end-to-end design, highlighting how human–AI collaboration is reshaping the path to innovation. Speaker: Olena Shu.
04/02, 10:00 am, CIS/CS, AMA (Ask me Anything) with MIT-Press-Machine-Learning-Books-Author, Prof. Ethem Alpaydın (Virtual) Please feel free to submit your questions via email or X. Speaker: Prof. Ethem Alpaydın, Ph.D.
04/02, 6:30 pm, SCV, Heat-Assisted Magnetic-Recording: Characterization of Media Properties (Hybrid) We will review the design and characterization of media used in heat-assisted magnetic recording (HAMR). Speaker: Dr. Pierre-Olivier Jubert.
04/02, 6:30 pm, TEMS, AI & The Future of Platform Engineering (Hybrid) Attendees will receive a comprehensive blueprint for safely managing the transition to AI-operated infrastructure, ensuring their systems remain highly intelligent and fundamentally incorruptible. Speaker: Ankush Sharma, Kunal Kannav.
04/07, 6:00 pm, SSIT, Future of Work in the Age of AI (Hybrid) We will explore the Future of Work with speakers who will address the technical and business workforce environment given the changes that have transpired with the increasing use of generative and agentic AI. Speaker: Claudionor Coelho, and others.
04/09, 12:30 pm, SPS, Towards Building Natural Conversational Agents (Virtual) I will present some of the recent progresses in building conversational agents, with a focus on the speech modality. Speaker: Dr. Dong Yu.
04/10, 12:00 pm, EPS, Using Architectural Simulation to Investigate Chiplets for Scalable and Cost Effective HPC Beyond Exascale (Virtual) Recently, the community has proposed several new standards to facilitate integration and interoperability of any compliant chiplet. Architectural modeling and simulation will play a critical role in pathfinding for this new potential direction for HPC beyond Exascale. Speaker: John Shalf.
04/10, 3:00 pm, CS/EPS, Characteristics of Successful Tech Hubs and Start-ups: Lessons for Engineers (San Jose) In this talk, the key Silicon Valley attributes will be illustrated and analyzed, for consideration by engineers interested in creating their own start-ups and high-tech businesses, working for them, or simply understanding them. Speaker: Paul Wesling.
04/14, 7:00 pm, CNSV, Conversational AI: Practical Challenges in Talking to People (Hybrid) In this talk, Elena Gostrer will examine these behaviors from a practical, product-engineering perspective. Speaker: Elena Gostrer.
04/15, 7:00 pm, LMAG, Advancing Clean Energy: Ontario’s Darlington New Nuclear Project (DNNP) (Virtual) DNNP is at the forefront of deploying Small Modular Reactor (SMR) technology in Canada. The project will help meet rising electricity demand, advance electrification, and deliver reliable, carbon-free power. Speaker: Michael Takla.
4/16, 5:30 pm, IAS, Characterizing 2nd Law Efficiency of AI Datacenters (Pleasant Hill) We introduce an approach to quantify the transitional entropy generated during datacenter power fluctuations as a metric to evaluate datacenter performance using power demand measurements. Speaker: Ratnesh K Sharma, PhD, P.E.
4/22,11:00 am, LMAG, Quarterly social meeting and program (Livermore) Reserve this date for a social gathering and a program of general interest to be determined.
05/07, 12:00 pm, EPS, Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing, Virtual. The speaker will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. Speaker: Francesco Carobolante.
05/19 8:00 am, EPS, Third Annual IEEE Build-Up Substrate Symposium (San Jose) This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. Speakers: multiple, see agenda.
05/25, 9:00 am, IEEE Canada Blockchain Forum 2026 (4th edition) (Virtual) The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Speakers: multiple see agenda.
Calendar View of IEEE Events
If you have missed an event search it in the calendar above and contact the organizing chapter for a life recording or look for it on the chapter‘s archive page.
Contact us, and learn more about volunteering opportunities in our sections.
Use “IEEE” (case sensitive) discount code to receive 50% off admission to the Computer History Museum. IEEE members will be asked to show proof of membership to redeem their discount when arriving at the Museum. Direct ticket link.
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