#5/26 March 2026 – Subscribe the newsletter – Contact editor – Visit SFBAC – Join IEEE
Editor’s Recommendations
Last chance to register for OzenCon, submission deadline to ECCE 2026 has been prolonged. Don’t miss the opportunity to listen to the latest CES trends or listen in to the FPGA 40 years celebration.
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- The AI-Ready Manager: Master AI tools to streamline workflows, enhance team coaching, and drive data-backed decision-making.
- Clear Business & Email Writing with AI: Learn to use AI for concise, goal-oriented communication—from persuasive techniques to improved clarity.
- Presentation Skills with AI: Use AI-assisted storytelling and the “5 P’s Framework” to design and deliver high-impact technical presentations enhanced by AI-assisted storytelling and analogy creation.
For more details contact us, or visit our web page!
Join us for a one-day conference dedicated to exploring how simulation empowers engineers to innovate faster and smarter on March 10th at the Computer History Museum (CHM). For registration and details, visit OzenCon Website Link.
The 27th ISQED Conference April 8-10, 2026
Registration is now open for the 27th International Symposium on Quality Electronic Design (ISQED), taking place April 8-10, 2025. ISQED is the leading conference for design for manufacturability (DFM) and quality (DFQ) issues. As the leading event in the field, it is your chance to network with top experts across the electronics and semiconductor ecosystem. Register today!
Scale Your Innovation at the IEEE Hard Tech Venture Summit (HTVS) Silicon Valley
Fueling Hard Tech growth through capital, mentorship, and resources.
Last year attendees’ experience.
The IEEE Hard Tech Venture Summit (HTVS) is designed for Pre-Seed to Series A startups building complex physical technologies.
This is your opportunity to:
- Pitch to Hard Tech Investors backing hardware, manufacturing, and deep-tech innovation.
- Solve Technical Hurdles with hands-on guidance from manufacturing experts.
- Build Strategic Partnerships that accelerate Hard Tech fundraising, production, and market entry.
IEEE Energy Conversion Congress & Expo
Convention Center, Vancouver, BC,
October 4-8, 2026.
ECCE 2026 is the pivotal international conference and exposition event on the electrical and electromechanical energy conversion field. The Conference will bring together practicing engineers, researchers, and other professionals for interactive and multidisciplinary discussions on the latest advances in various areas related to energy conversion.
Call for Papers is open. Focus areas are : component, converter and subsystem technologies and energy conversion systems and applications. Submission deadline extended to March 6th. For details visit out submission web page.
IEEE Local Chapter Events
03/03, 5:30 pm, CIS, Recent Advancements in Image Generation and Understanding, Virtual. In this talk, Dr. Roy will provide an overview of his research and then takes a closer look at three recent works. Speaker: Dr. Aniket Roy.
03/05, 5:30 pm, CTSoc, CES Downloaded, Hybrid. This is the annual CTSoc event providing a summary of the latest and unique tech innovations from the 2026 Consumer Electronics Show (CES) in Las Vegas. Speakers: Tom Coughlin, Avery Lu.
03/10, 7:00 pm, CNSV, The FPGA: 40 Years of Change, Hybrid. A milestone talk examining the industry’s history and the transformations ahead for FPGA technology. Speaker Dr. Steve Trimberger.
03/11, 6:30 pm, MAG, Projected Field Electromagnets for Controllable Magnetic Field at a Point, Hybrid. We will review the development of projected-field electromagnets for device testing. Speaker: Ian Walker.
03/18,4:45 pm, CIS/CS, Chapter Open House and talk on AI Infrastructure, Hybrid. We will explore why modern AI clusters have moved toward hardware offloads (like RDMA) to achieve the high throughput and low latency required for GPU-to-GPU communication. Speakers: Sujithra Periasamy, Dr. Vishnu S. Pendyala.
3/19, 11:30 am, NANO, Silicon Metasurfaces for DNA Synthesis, Sunnyvale. In this talk, I will introduce B-MOS (Metasurface Oligonucleotide Synthesizer for Engineered Biology) — a novel platform that integrates silicon nanophotonics with solid-phase DNA synthesis to overcome these challenges. Speaker: Dr. Punnag Padhy.
3/19, 5:30 pm, IAS, Understanding Tier 4 Emissions for Generator Sets, Pleasant Hill. This presentation will offer insights on how to design a reliable system that meets local and national code requirements. Speaker; Shen Yoon.
03/23, 6:00 pm, MTT, Edge AI Meets Wireless Systems: Implications for Connectivity, Architecture, and RF Design, Hybrid. In this talk, I will discuss how emerging Edge AI workloads challenge long-standing assumptions in wireless and RF system design. Speaker: Dr. Roberto Morabito.
03/26, 12:00 pm, EPS, Co-Packaged Optics: Heterogeneous Integration of Chiplets in Switches, Photonic ICs and Electronic ICs, Virtual. In the next few years, we will see more implementations of a higher level of heterogeneous integration of switch, PIC and EIC, whether it is for performance, form factor, power consumption or cost. Speaker: John Lau.
03/27, 6:00 pm, WIE, Designing Your Early Career: LinkedIn, Resume & Interview Strategy That Works, Virtual. In this practical and engaging session, students and early-career professionals can learn to strategically present their academic work, projects, internships, and experiences to stand out. Speaker: Shima Ghaheri.
03/28, 12:00 pm, YP, Leadership Hike, Hayward. Hike at Green Belt Trail with Leadership Workshop, followed by lunch provided at Buffalo Bils.
04/01,5:30 pm, EMC, Augmented Intelligence for End-to-End Design, San Jose. In this talk, I will share practical examples and key insights from several years of applying Augmented Intelligence to end-to-end design, highlighting how human–AI collaboration is reshaping the path to innovation. Speaker: Olena Shu.
04/02, 10:00 am, CIS/CS, AMA (Ask me Anything) with MIT-Press-Machine-Learning-Books-Author, Prof. Ethem Alpaydın, Virtual. Please feel free to submit your questions via email or X. Speaker: Prof. Ethem Alpaydın, Ph.D.
04/10, 12:00 pm, EPS, Using Architectural Simulation to Investigate Chiplets for Scalable and Cost Effective HPC Beyond Exascale, Virtual. Recently, the community has proposed several new standards to facilitate integration and interoperability of any compliant chiplet. Architectural modeling and simulation will play a critical role in pathfinding for this new potential direction for HPC beyond Exascale. Speaker: John Shalf.
04/14, 7:00 pm, CNSV, Conversational AI: Practical Challenges in Talking to People, Hybrid. In this talk, Elena Gostrer will examine these behaviors from a practical, product-engineering perspective. Speaker: Elena Gostrer.
4/16, 5:30 pm, IAS, Characterizing 2nd Law Efficiency of AI Datacenters, Pleasant Hill. We introduce an approach to quantify the transitional entropy generated during datacenter power fluctuations as a metric to evaluate datacenter performance using power demand measurements. Speaker: Ratnesh K Sharma, PhD, P.E.
4/22,11:00 am, LMAG, Quarterly social meeting and program, Livermore. Reserve this date for a social gathering and a program of general interest to be determined.
05/19 8:00 am, EPS, Third Annual IEEE Build-Up Substrate Symposium, San Jose. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. Speakers: multiple, see agenda.
05/25, 9:00 am, IEEE Canada Blockchain Forum 2026 (4th edition), Virtual. The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Speakers: multiple see agenda.
Calendar View of IEEE Events
If you have missed an event search it in the calendar above and contact the organizing chapter for a life recording or look for it on the chapter‘s archive page.
Science Fairs
For over 40 years, the IEEE has proudly supported local science fairs by providing both prizes and volunteer judges, and we need your help once again! As a judge, you will interact with students to offer encouragement and constructive feedback on their projects. No specialized knowledge is required—just patience, common sense, and a desire to support young innovators.
This year, IEEE is supporting five science fairs and one hands-on event:
- San Benito County: Tuesday, March 3 (Exhibit judging)
- San Benito County: Thursday, March 5 (Awards and IEEE hands-on exhibit)
- Monterey County: Saturday, March 7 — Monterey.zfairs.com (In-Person)
- Santa Clara: Tuesday, March 10 — science-fair.org (In-Person)
- San Mateo: Saturday, March 14 — stemfair.net (Virtual)
- Santa Cruz: Saturday, March 28 — ca-scc.zfairs.com (In-Person)
Support the Next Generation Beyond judging, we are also looking for individuals or organizations to sponsor prizes. This is a wonderful way to reward student ingenuity and invest in the future of our local STEM community.
If you are interested in judging or sponsoring a prize, please contact us!
Use “IEEE” (case sensitive) discount code to receive 50% off admission to the Computer History Museum. IEEE members will be asked to show proof of membership to redeem their discount when arriving at the Museum. Direct ticket link.
* Antenna and Propagation Society (APS) * Blockchain (BC) * Circuits & Systems Society (CASS) * Consultants’ Network of Silicon Valley (CNSV)* Consumer Technology Society (CTSoc) * Control Systems Society (CSS) * Communications Society (ComSoc) * Computer Society (CS)* Computational Intelligence Society (CIS) * Corporate Liaison Program (CLP) * Electron Devices Society (EDS) * Electronic Packaging Society (EPS) * Electromagnetic Compatibility (EMC) * Engineering In Medicine & Biology Society (EMBS) * Industry Applications Society (IAS) * Industry Engagement (IE) * Industry Hub (IIH) * Instrumentation & Measurement Society (IMS) * Life Members Affinity Group (LMAG)* Magnetics Society (MAG) * MEMS & Sensors Council (MEMS) * Microwave Theory & Techniques (MTT) * Nanotechnology Council(NANO) * Nuclear & Plasma Sciences (NUE) * Photonics (PHOT)* Power & Energy Society (PES) & Industry Applications Society (IAS) * Power Electronics Society (PELS) * Product Safety Engineering (PSE) * Reliability (REL) * Robotics & Automation (RAS) * Silicon Valley Sustainability Chapter (SUST) * Signal Processing Society (SPS) * Silicon Valley Technology History Committee (SVTHC) * Society for Social Implications of Technology (SSIT) * Solid State Circuits Society (SSCS) * Startup Special Interest Group (SIG) * Student Branch (STB) * Technology and Engineering Management Society (TEMS) * Vehicular Technology Society (VTS) * Women In Engineering Affinity Group (WIE) * Young Professionals Affinity Group (YP)